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Research Papers: Electronic Cooling

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

[+] Author and Article Information
Christopher Cardenas1

Department of Mechanical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053; Center for Nanostructures,  Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053CVCardenas@gmail.com

Drazen Fabris, Shawn Tokairin

Department of Mechanical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053; Center for Nanostructures,  Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053

Francisco Madriz, Cary Y. Yang

Department of Electrical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053; Center for Nanostructures,  Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053

1

Corresponding author.

J. Heat Transfer 134(11), 111401 (Sep 28, 2012) (7 pages) doi:10.1115/1.4007068 History: Received May 16, 2011; Revised May 28, 2012; Published September 26, 2012; Online September 28, 2012

To improve performance and reliability of integrated circuits, accurate knowledge of thermal transport properties must be possessed. In particular, reduced dimensions increase boundary scattering and the significance of thermal contact resistance. A thermoreflectance measurement can be used with a valid heat transport model to experimentally quantify the contact thermal resistance of thin film interconnects. In the current work, a quasi-steady state thermoreflectance measurement is used to determine the temperature distribution of a thin film gold interconnect (100 nm) undergoing Joule heating. By comparing the data to a heat transport model accounting for thermal diffusion, dissipation, and Joule heating, a measure of the thermal dissipation or overall thermal resistance of unit area is obtained. The gold film to substrate overall thermal resistance of unit area beneath the wide lead (10 μm) and narrow line (1 μm) of the interconnect are 1.64 × 10−6 m2 K/W and 5.94 × 10−6 m2 K/W, respectively. The thermal resistance of unit area measurements is comparable with published results based on a pump-probe thermoreflectance measurement.

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Copyright © 2012 by American Society of Mechanical Engineers
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Figures

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Figure 1

Thin gold film sample (a) schematic of layered deposition (b) microscope image

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Figure 2

Thermoreflectance system schematic diagram with hardware components

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Figure 3

Heating, delay, and image acquisition timing signals for quasi-steady lock-in thermoreflectance imaging. Low power LED illumination is constant. IA and IB refer to heated and cooled reflectance intensity images, respectively.

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Figure 4

Thermoreflectance calibration under LED illumination. Data from Refs. [28] and [29] are included for comparison of results for similar techniques on similar structures.

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Figure 5

2D temperature difference measurement during quasi-steady increase of Joule heating in the structure under λLED  = 535 nm

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Figure 6

Temperature profile data (λLED  = 535 nm) with best-fit 2D model solutions (solid lines). Repeated measurements were performed at the lower current levels.

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Figure 7

Temperature profile data with 2D model fitting (solid lines) and 1D model fitting (dotted lines)

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