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Technical Briefs

An Experimental Investigation of the Heat Transfer Performance of an Oscillating Heat Pipe With Copper Oxide (CuO) Microstructure Layer on the Inner Surface

[+] Author and Article Information
Yulong Ji

e-mail: jiyulongcn@163.com

Chen Xu, Pan Xinxiang

Marine Engineering College,
Dalian Maritime University,
Dalian, 116026, Liaoning Province, China

Hongbin Ma

Department of Mechanical and Aerospace Engineering,
University of Missouri,
Columbia, MO 65211

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received September 6, 2012; final manuscript received February 16, 2013; published online June 6, 2013. Assoc. Editor: James A. Liburdy.

J. Heat Transfer 135(7), 074504 (Jun 06, 2013) (4 pages) Paper No: HT-12-1483; doi: 10.1115/1.4023749 History: Received September 06, 2012; Revised February 16, 2013

This paper presents an experimental investigation of whether heat transfer performance in an oscillating heat pipe (OHP) would improve if the inner surface of the heat pipe was coated with a layer of copper oxide (CuO). The OHP had six turns and three sections, i.e., evaporator, condenser, and adiabatic section with lengths of 40 mm, 64 mm, and 51 mm, respectively. The cleaned copper tubing was chemically treated with a chemical solution and heated in a furnace. A microstructure layer of CuO was formed in the inner surface of the OHP with K2S2O8 and KOH. The working fluid in this study was water with filling ratios ranging from 40% to 70%. The experimental results show that the CuO microstructure layer is superhydrophilic and can enhance the OHP heat transfer performance. The investigation results in a new way to enhance the heat transfer performance of an OHP.

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Figures

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Fig. 1

Schematic of experimental system (units in mm)

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Fig. 2

SEM images of a CuO layer on a flat copper plate: (a) 50 μm, (b) 10 μm

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Fig. 3

X-ray diffraction (XRD) test result of the layer (coating) formed on the copper plate (substrate)

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Fig. 4

Contact angle variation: (a) with CuO layer, (b) without CuO layer

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Fig. 5

Thermal resistance of the OHP: (a) with CuO layer, (b) without CuO layer (operating temperature: 20 °C)

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Fig. 6

Mean thermal resistance comparison between the OHPs with and without the CuO layer

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Fig. 7

Effective thermal conductivity (Keff) and heat flux of the OHP with CuO layer

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