Research Papers

High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift

[+] Author and Article Information
Heinz Herwig

Institute of Thermo-Fluid Dynamics,
Hamburg University of Technology,
Denickestraße 17, 21073 Hamburg, Germany
e-mail: h.herwig@tuhh.de

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Heat Transfer. Manuscript received June 28, 2012; final manuscript received August 8, 2013; published online September 23, 2013. Assoc. Editor: Sujoy Kumar Saha.

J. Heat Transfer 135(11), 111013 (Sep 23, 2013) (2 pages) Paper No: HT-12-1318; doi: 10.1115/1.4024621 History: Received June 28, 2012; Revised August 08, 2012

In a discussion initiated by the German Research Foundation (DFG) about cooling of electronics, two aspects turned out to be important: The need for a paradigm shift from an “add on” to an “integrated multidisciplinary” solution and the definition of generic demonstrators for cooling strategies.

Copyright © 2013 by ASME
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Grahic Jump Location
Fig. 2

Structure and properties of the generic demonstrators

Grahic Jump Location
Fig. 1

Conventional cooling strategy (add-on solution) for a chip as an example




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