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Technical Briefs

Improvement of Forced Convection Cooling Due to the Attachment of Heat Sources to a Conducting Thick Plate

[+] Author and Article Information
Mohammad Reza Hajmohammadi

Department of Mechanical Engineering,
Amirkabir University of Technology,
Tehran 15875-4413, Iran
e-mail: mh.hajmohammadi@yahoo.com

Antonio Campo

Department of Mechanical Engineering,
The University of Texas at San Antonio,
San Antonio, TX 78249
e-mail: Antonio.Campo@utsa.edu

S. Salman Nourazar

Department of Mechanical Engineering,
Amirkabir University of Technology,
Tehran 15875-4413, Iran
e-mail: icp@aut.ac.ir

Amir Masood Ostad

Department of Mechanical Engineering,
The University of Toledo,
Toledo, OH 43606-3390
e-mail: amirmasood.ostad@gmail.com

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Heat Transfer. Manuscript received December 12, 2012; final manuscript received June 15, 2013; published online October 14, 2013. Assoc. Editor: Jose L. Lage.

J. Heat Transfer 135(12), 124504 (Oct 14, 2013) (4 pages) Paper No: HT-12-1656; doi: 10.1115/1.4024897 History: Received December 12, 2012; Revised June 15, 2013

It is proposed that a conductive thick plate is placed between a heat source and a cold flowing fluid to improve the forced convection cooling performance. Detailed numerical work is carried out to determine the optimal thickness of the conductive thick plate which minimizes the peak temperature. It is shown that the thick plate significantly reduces the excess temperature of heat sources, by way of conducting the heat current in an optimal manner. It is shown that the reduction in the excess temperature of heat sources depends upon the Reynolds number of the fluid flow and the material thermal conductivity. Correlations for the optimum plate thickness and reduction in excess temperature of heat sources are presented, which could be useful for the practitioners.

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References

Figures

Grahic Jump Location
Fig. 2

The effect of the dimensionless thickness (aspect ratio) of the conducting plate, b/L, on the dimensionless peak temperature, θmax

Grahic Jump Location
Fig. 3

Variation of optimal aspect ratio of the plate, b/L)optimum and the corresponding minimized peak temperature, θmax)min with respect to variation of κ

Grahic Jump Location
Fig. 1

Geometry of the problem under study

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