This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. A grid structure on the collector electrodes can enhance the overall heat-transfer coefficient and facilitate an IC compatible batch process. The optimized devices studied exhibit an overall device area of 5.4 mm × 3.6 mm, an emitter-to-collector gap of ∼0.5 mm, and an emitter curvature radius of ∼12.5 μm. The manufacturing process developed for the device uses glass wafers, a single mask-based photolithography process, and a low-cost copper-based electroplating process. Various design configurations were explored and modeled computationally to investigate their influence on the cooling phenomenon. The single devices provide a high heat-transfer coefficient of up to ∼3200 W/m2 K and a coefficient of performance (COP) of up to ∼47. The COP was obtained by dividing the heat removal enhancement, ΔQ by the power consumed by the ionic wind pump device. A maximum applied voltage of 1.9 kV, which is equivalent to approximately 38 mW of power input, is required for operation, which is significantly lower than the power required for the previously reported devices. Furthermore, the microfabricated single device exhibits a flexible and small form factor, no noise generation, high efficiency, large heat removal over a small dimension and at low power, and high reliability (no moving parts); these are characteristics required by the semiconductor industry for next generation thermal management solutions.