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Research Papers: Experimental Techniques

Specific Heat Determination of Metallic Thin Films at Room Conditions

[+] Author and Article Information
J. M. Lugo

Departamento de Física Aplicada,
Centro de Investigación y de Estudios
Avanzados del IPN-Unidad Mérida,
A.P. 73-Cordemex,
Mérida Yucatán 97310, Mexico
e-mail: jquintal@mda.cinvestav.mx

V. Rejón, A. I. Oliva

Departamento de Física Aplicada,
Centro de Investigación y de Estudios
Avanzados del IPN-Unidad Mérida,
A.P. 73-Cordemex,
Mérida Yucatán 97310, Mexico

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received July 16, 2014; final manuscript received December 26, 2014; published online February 3, 2015. Assoc. Editor: Amy Fleischer.

J. Heat Transfer 137(5), 051601 (May 01, 2015) (11 pages) Paper No: HT-14-1474; doi: 10.1115/1.4029595 History: Received July 16, 2014; Revised December 26, 2014; Online February 03, 2015

A methodology to evaluate the specific heat of metallic thin films at constant pressure and 300 K by means of the heating profile is proposed. Changes on the electrical resistance of metallic films after the application of short electric pulses (20–500 μs) are correlated with changes of temperature of the films. Electric pulses are applied on films by an implemented electronic device. A proposed analytical thermal model predicts the correlation between the duration of the electric pulses and the thermal profiles of the film/substrate systems. The analytical thermal model and the measured thermal profiles results are useful to evaluate the specific heat of films. Following this methodology, Au and Al nanofilms evaporated on glass substrates were analyzed. Results indicate that specific heat values of Au films decrease from (229 ± 15) J/kg K to (125 ± 8) J/kg K, and for Al films from (1444 ± 89) J/kg K to (947 ± 53) J/kg K, for film thicknesses from 20 to 200 nm.

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References

Figures

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Fig. 1

The metallic film/substrate system used for the thermal analysis

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Fig. 2

Heating profiles simulated for the Au/glass system for 100 and 200 nm of Au-thickness. Time constant is τfs = 58 s and the thickness of glass substrate is 1.0 mm.

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Fig. 3

Heating profiles simulated for the Au/glass system. Time constants τf for the films are Au(100 nm) = 255 μs and Au(200 nm) = 510 μs.

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Fig. 4

Quantification of the different heat transfer mechanisms in the Au/glass system with 100 nm thickness during the first 300 μs of heating time

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Fig. 5

Linear behavior of the constant time τf value as a function of the Au film thickness (100–200 nm). Extrapolation line toward lower thicknesses is included.

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Fig. 6

Linear behavior of constant time τfs as a function of the glass substrate thickness

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Fig. 7

Block diagram of the experimental system proposed for micropulses generation

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Fig. 8

Micropulse of 20 μs applied on an Au(100 nm)/glass (1.0 mm) system (Rref = 10 Ω)

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Fig. 12

Best fitting on the film response after application of: (a) a pulse of 200 μs on the Au(100 nm)/glass system and (b) a pulse of 250 μs on the Al(100 nm)/glass system

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Fig. 9

The αfbulk ratio calculated by Tellier and Tosser [27] Eq. (2c) for different (df) values

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Fig. 16

Measured heating profiles obtained by the application of various pulses (20 μs) on the Au(20 nm)/glass system

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Fig. 15

Heating profiles obtained with different applied pulses (20, 40, and 100 μs) on the Au(100 nm) film

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Fig. 14

Quantification of the different heat transfer mechanisms in two thin film/substrate systems with 100 nm thickness during the first 100 μs of heating time for Au and Al films

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Fig. 13

Changes of temperature obtained during the applied pulses of 200 μs on the Au(100 nm)/glass system; and 250 μs on the Al(100 nm)/glass system as calculated by Eq. (1c). The initial slope for each heating profile is highlighted.

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Fig. 11

Applied pulses and film responses for: (a) Au (100 nm) and pulse of 200 μs; (b) Al(100 nm) and pulse of 250 μs (Rref = 10 Ω)

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Fig. 10

Arrangement of the electrodes employed in the analyzed films

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Fig. 18

Specific heat Cpf values for Au and Al films as a function of thickness as estimated from the heating profiles obtained with applied electric pulses

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Fig. 17

Comparison between the measured and the analytical heating profiles obtained for (a) Au and (b) Al films with different thickness and different electrical pulses

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