0
Research Papers

Pool Boiling Enhancement by Electrohydrodynamic Force and Diamond Coated Surfaces

[+] Author and Article Information
Ichiro Kano

Graduate School of Science and Engineering,
Yamagata University,
4-3-16 Jonan,
Yonezawa, Yamagata 992-8510, Japan
e-mail: kano@yz.yamagata-u.ac.jp

Manuscript received February 12, 2014; final manuscript received August 13, 2014; published online May 14, 2015. Assoc. Editor: Yogesh Jaluria.

J. Heat Transfer 137(9), 091006 (Sep 01, 2015) (9 pages) Paper No: HT-14-1073; doi: 10.1115/1.4030217 History: Received February 12, 2014; Revised August 13, 2014; Online May 14, 2015

Boiling heat transfer enhancement via compound effect of the electrohydrodynamic (EHD) effect and microstructured surfaces has been experimentally and analytically investigated. A fluorinated dielectric liquid (Asahi Glass Co., Ltd., AE-3000) was selected as the working fluid. Pool boiling heat transfer in the saturated liquid was measured at atmospheric pressure. Microstructured surfaces, which are mainly used for cutting tools, were developed with diamond particles using electrodeposition technique. Four different particle diameters were prepared: 5, 10, 15, and a mixture of 5 and 1.5 μm. The critical heat flux (CHF) for diamond particle surfaces showed 27–30 W/cm2 which was 26–40% increase for comparing with a noncoated surface (21.5 W/cm2). Upon application of a −5 kV/mm electric field to the microstructured surface (a mixture of 5 and 1.5 μm particles), a CHF of 70.2 W/cm2 at a superheat of 21.7 K was obtained. The previous theoretical equation of pool boiling predicted the CHF with electric field and without the electrode within 10%. Also, the CHF enhanced by the diamond coated surfaces was correlated well with the contact angle.

Copyright © 2015 by ASME
Your Session has timed out. Please sign back in to continue.

References

Zuber, N., 1958, “On the Stability of Boiling Heat Transfer,” ASME J. Heat Transfer, 80, pp. 711–720.
Lüttch, T., Marquardt, W., Buchholz, M., and Auracher, H., 2004, “Towards a Unifying Heat Transfer Correlation for the Entire Boiling Curve,” Int. J. Therm. Sci., 43(12), pp. 1125–1139. [CrossRef]
Stuetzer, O. M., 1959, “Ion Drag Pressure Generation,” J. Appl. Phys., 30(7), pp. 984–994. [CrossRef]
Pickard, W. F., 1963, “Ion-Drag Pumping. I. Theory,” J. Appl. Phys., 34(2), pp. 246–250. [CrossRef]
Pickard, W. F., 1963, “Ion-Drag Pumping. II. Experiment,” J. Appl. Phys., 34(2), pp. 251–258. [CrossRef]
Jones, T. B., 1978, “Electrohydrodynamically Enhanced Heat Transfer in Liquids—A Review,” Adv. Heat Transfer, 14, pp. 107–148. [CrossRef]
Marco, D. P., and Grassi, W., 1993, “Saturated Pool Boiling Enhancement by Means of an Electric Field,” J. Enhanced Heat Transfer, 1(1), pp. 99–114. [CrossRef]
Allen, P. H. G., and Karayiannis, T. G., 1994, “Electrohydrodynamic Enhancement of Heat Transfer and Fluid Flow,” Heat Recovery Syst. CHP, 15(5), pp. 389–423. [CrossRef]
Laohalertdecha, S., Naphon, P., and Wongwises, S., 2007, “A Review of Electrohydrodynamic Enhancement of Heat Transfer,” Renewable Sustainable Energy Rev., 11(5), pp. 858–876. [CrossRef]
Hristov, Y., Zhao, D., Kenning, D. B. R., Sefiane, K., and Karayiannis, T. G., 2009, “A Study of Nucleate Boiling and Critical Heat Flux With EHD Enhancement,” Heat Mass Transfer, 45(7), pp. 999–1017. [CrossRef]
Saville, D. A., 1997, “Electrohydrodynamics: The Taylor-Melcher Leaky Dielectric Model,” Annu. Rev. Fluid Mech., 29(1), pp. 27–64. [CrossRef]
Atten, P., and Seyed-Yagoobi, J., 2003, “Electrohydrodynamically Induced Dielectric Liquid Flow Through Pure Conduction in Point/Plane Geometry,” IEEE Trans. Dielectr. Electr. Insul., 10(1), pp. 27–36. [CrossRef]
Seyed-Yagoobi, J., 2005, “Electrohydrodynamic Pumping of Dielectric Liquids,” J. Electrost., 63(6–10), pp. 861–869. [CrossRef]
Landau, L. D., Lifshitz, E. M., and Pitaevskii, L. P., 1984, Electrohydrodynamics of Continuous Media, 2nd ed., Vol. 8, Butterworth-Heineman, Oxford, UK, pp. 59–64.
Kano, I., Takahashi, I., and Nishina, T., 2009, “Effects of Moisture Content in a Dielectric Liquid on Electrohydrodynamic Pumping,” IEEE Trans. Ind. Appl., 45(1), pp. 59–66. [CrossRef]
Kano, I., and Nishina, T., 2010, “Electrode Arrangement for Micro-Scale Electrohydrodynamic Pumping,” J. Fluid Sci. Technol., 5(2), pp. 123–134. [CrossRef]
Jones, T. B., 1995, Electromechanics of Particles, Cambridge University Press, New York, pp. 24–30.
Panofsky, W. K. H., 1962, Classical Electricity and Magnetism, 2nd ed., Dover Publications, New York, pp. 111–116.
Kano, I., 2014, “Effect of Electric Field Distribution Generated in a Microspace on Pool Boiling Heat Transfer,” ASME J. Heat Transfer, 136(10), p. 101501. [CrossRef]
Darabi, J., Ohadi, M. M., and DeVoe, D., 2001, “An Electrohydrodynamic Polarization Micropump for Electronic Cooling,” J. Microelectromech. Syst., 10(1), pp. 98–106. [CrossRef]
Darabi, J., and Ekula, K., 2003, “Development of a Chip-Integrated Micro Cooling Device,” Microelectron. J., 34(11), pp. 1067–1074. [CrossRef]
Moghaddam, S., and Ohadi, M. M., 2005, “Effect of Electrode Geometry on Performance of an EHD Thin-Film Evaporator,” J. Microelectromech. Syst., 14(5), pp. 978–986. [CrossRef]
Kano, I., Higuchi, Y., and Chika, T., 2013, “Development of Boiling Type Cooling System Using Electrohydrodynamics Effect,” ASME J. Heat Transfer, 135(9), p. 091301. [CrossRef]
Lamb, H., 1932, Hydrodynamics, 6th ed., Cambridge University Press, Cambridge, UK.
O'Connor, J. P., You, S. M., and Price, D. C., 1995, “A Dielectric Surface Coating Technique to Enhance Boiling Heat Transfer From High Power Microelectronics,” IEEE Trans. Compon., Packag., Manuf. Technol., Part A, 18(3), pp. 656–663. [CrossRef]
Das, A. K., Das, P. K., and Saha, P., 2007, “Nucleate Boiling of Water From Plain and Structured Surfaces,” Exp. Therm. Fluid Sci., 31(8), pp. 967–977. [CrossRef]
Tong, L. S., and Tang, Y. S., 1997, Boiling Heart Transfer and Two-Phase Flow, 2nd ed., Taylor & Francis, New York, pp. 37–40.
Auracher, H., and Marquardt, W., 2004, “Heat Transfer Characteristics and Mechanisms Along Entire Boiling Curves Under Steady-State and Transient Conditions,” Int. J. Heat Fluid Flow, 25(2), pp. 223–242. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

Simple electrode device for measuring electrostatic pressure

Grahic Jump Location
Fig. 2

Electrostatic pressure for AE-3000 [19]

Grahic Jump Location
Fig. 3

Vapor removal configuration for boiling around slit electrodes [19]

Grahic Jump Location
Fig. 4

Schematic diagram of the experimental setup

Grahic Jump Location
Fig. 5

Schematic diagram of the copper block (dimensions in mm)

Grahic Jump Location
Fig. 6

Structure of electrodeposited layers and diamond particles. Four different diamond particles are prepared with 5, 10, 15, and a mixture of 5 and 1.5 μm. The corresponding dimensions of the thin films are listed in Table 1.

Grahic Jump Location
Fig. 7

Electrically codeposited surface containing diamond particles and metal layers: (a) D = 10 μm and (b) D = 5 and 1.5 μm

Grahic Jump Location
Fig. 8

Electrode geometry (dimensions in mm) [19,23]

Grahic Jump Location
Fig. 9

Boiling curve for an electrodeposited diamond surface without electrode

Grahic Jump Location
Fig. 10

Heat transfer coefficient for an electrodeposited diamond surface without electrode

Grahic Jump Location
Fig. 11

Effect of diamond particle diameters on the boiling curve without electrode

Grahic Jump Location
Fig. 12

Effect of diamond particle diameters on the heat transfer coefficients without electrode

Grahic Jump Location
Fig. 13

Effect of contact angle on CHF

Grahic Jump Location
Fig. 14

SEM image of a boiling surface electrically deposited for 10 μm diamond particles

Grahic Jump Location
Fig. 15

Effect of diamond particle number density on superheat at CHF

Grahic Jump Location
Fig. 16

Effect of the electric field on boiling curves

Grahic Jump Location
Fig. 17

Conceptual geometries of boiling enhancement [19]: (a) cross section and (b) projected figure

Grahic Jump Location
Fig. 18

Effect of contact angle on normalized CHF with and without electric field

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In