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Research Papers

Pool Boiling Enhancement by Electrohydrodynamic Force and Diamond Coated Surfaces

[+] Author and Article Information
Ichiro Kano

Graduate School of Science and Engineering,
Yamagata University,
4-3-16 Jonan,
Yonezawa, Yamagata 992-8510, Japan
e-mail: kano@yz.yamagata-u.ac.jp

Manuscript received February 12, 2014; final manuscript received August 13, 2014; published online May 14, 2015. Assoc. Editor: Yogesh Jaluria.

J. Heat Transfer 137(9), 091006 (Sep 01, 2015) (9 pages) Paper No: HT-14-1073; doi: 10.1115/1.4030217 History: Received February 12, 2014; Revised August 13, 2014; Online May 14, 2015

Boiling heat transfer enhancement via compound effect of the electrohydrodynamic (EHD) effect and microstructured surfaces has been experimentally and analytically investigated. A fluorinated dielectric liquid (Asahi Glass Co., Ltd., AE-3000) was selected as the working fluid. Pool boiling heat transfer in the saturated liquid was measured at atmospheric pressure. Microstructured surfaces, which are mainly used for cutting tools, were developed with diamond particles using electrodeposition technique. Four different particle diameters were prepared: 5, 10, 15, and a mixture of 5 and 1.5 μm. The critical heat flux (CHF) for diamond particle surfaces showed 27–30 W/cm2 which was 26–40% increase for comparing with a noncoated surface (21.5 W/cm2). Upon application of a −5 kV/mm electric field to the microstructured surface (a mixture of 5 and 1.5 μm particles), a CHF of 70.2 W/cm2 at a superheat of 21.7 K was obtained. The previous theoretical equation of pool boiling predicted the CHF with electric field and without the electrode within 10%. Also, the CHF enhanced by the diamond coated surfaces was correlated well with the contact angle.

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References

Figures

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Fig. 1

Simple electrode device for measuring electrostatic pressure

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Fig. 2

Electrostatic pressure for AE-3000 [19]

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Fig. 3

Vapor removal configuration for boiling around slit electrodes [19]

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Fig. 4

Schematic diagram of the experimental setup

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Fig. 5

Schematic diagram of the copper block (dimensions in mm)

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Fig. 6

Structure of electrodeposited layers and diamond particles. Four different diamond particles are prepared with 5, 10, 15, and a mixture of 5 and 1.5 μm. The corresponding dimensions of the thin films are listed in Table 1.

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Fig. 7

Electrically codeposited surface containing diamond particles and metal layers: (a) D = 10 μm and (b) D = 5 and 1.5 μm

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Fig. 8

Electrode geometry (dimensions in mm) [19,23]

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Fig. 9

Boiling curve for an electrodeposited diamond surface without electrode

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Fig. 10

Heat transfer coefficient for an electrodeposited diamond surface without electrode

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Fig. 11

Effect of diamond particle diameters on the boiling curve without electrode

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Fig. 12

Effect of diamond particle diameters on the heat transfer coefficients without electrode

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Fig. 13

Effect of contact angle on CHF

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Fig. 14

SEM image of a boiling surface electrically deposited for 10 μm diamond particles

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Fig. 15

Effect of diamond particle number density on superheat at CHF

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Fig. 16

Effect of the electric field on boiling curves

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Fig. 17

Conceptual geometries of boiling enhancement [19]: (a) cross section and (b) projected figure

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Fig. 18

Effect of contact angle on normalized CHF with and without electric field

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