Research Papers

Atomistic-Continuum Hybrid Simulation of Heat Transfer Between Argon Flow and Copper Plates

[+] Author and Article Information
Yijin Mao, C. L. Chen

Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211

Yuwen Zhang

Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: zhangyu@missouri.edu

Manuscript received April 20, 2014; final manuscript received January 27, 2015; published online May 14, 2015. Assoc. Editor: L. Q. Wang.

J. Heat Transfer 137(9), 091011 (Sep 01, 2015) (7 pages) Paper No: HT-14-1226; doi: 10.1115/1.4030224 History: Received April 20, 2014; Revised January 27, 2015; Online May 14, 2015

A simulation work aiming to study heat transfer coefficient between argon fluid flow and copper plate is carried out based on atomistic-continuum hybrid method. Navier–Stokes equations for continuum domain are solved through the pressure implicit with splitting of operators (PISO) algorithm, and the atom evolution in molecular domain is solved through the Verlet algorithm. The solver is validated by solving Couette flow and heat conduction problems. With both momentum and energy coupling method applied, simulations on convection of argon flows between two parallel plates are performed. The top plate is kept as a constant velocity and has higher temperature, while the lower one, which is modeled with FCC copper lattices, is also fixed but has lower temperature. It is found that the heat transfer between argon fluid flow and copper plate in this situation is much higher than that at macroscopic when the flow is fully developed.

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Grahic Jump Location
Fig. 1

Schematic of domain decomposition

Grahic Jump Location
Fig. 2

Computation flow chart

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Fig. 3

Couette flow: (a) configuration and (b) final velocity profiles

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Fig. 4

Heat conduction: (a) configuration and (b) final temperature profiles

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Fig. 5

Velocity and temperature profiles for Couette flow with heat transfer

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Fig. 6

Variation of heat flux variation with simulation time-step




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