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Technical Brief

Thermal Conductivity of Self-Assembling Symmetric Block Copolymer Thin Films of Polystyrene-Block-Poly(methyl methacrylate)

[+] Author and Article Information
Matthew C. George

Moxtek,
Orem, UT 84057;
Sandia National Laboratories,
Albuquerque, NM 87185
e-mail: mgeorge@moxtek.com

Mark A. Rodriguez, Michael S. Kent

Sandia National Laboratories,
Albuquerque, NM 87185

Geoff L. Brennecka

Metallurgical and Materials Engineering,
Colorado School of Mines,
Golden, CO 80401;
Sandia National Laboratories,
Albuquerque, NM 87185

Patrick E. Hopkins

Department of Mechanical and Aerospace Engineering, University of Virginia,
Charlottesville, VA 22904
e-mail: phopkins@virginia.edu

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received March 5, 2015; final manuscript received August 13, 2015; published online October 21, 2015. Assoc. Editor: Alan McGaughey.The United States Government retains, and by accepting the article for publication, the publisher acknowledges that the United States Government retains, a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this work, or allow others to do so, for United States government purposes.

J. Heat Transfer 138(2), 024505 (Oct 21, 2015) (5 pages) Paper No: HT-15-1172; doi: 10.1115/1.4031701 History: Received March 05, 2015; Revised August 13, 2015

The thermal conductivities of both disordered and self-assembled symmetric polystyrene-block-poly(methyl methacrylate) (PS-b-PMMA) copolymer films were measured using time-domain thermoreflectance (TDTR). The variation in out-of-plane thermal conductivity with changing block copolymer thickness is similar to that of PMMA polymer brushes and thick spun-cast films. The results suggest that the interfaces between the PS and PMMA, and reorganization of the PS and PMMA chains around these interfaces, do not significantly affect the thermal transport in these PS-b-PMMA films. However, for thin PS-b-PMMA films, the thermal boundary resistances at the sample interfaces limit the thermal transport.

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Figures

Grahic Jump Location
Fig. 1

(a) Block copolymer assembly schematic for the asymmetric wetting condition. (b) and (d) XRR data and modeling. (b) Thick annealed film commensurate with 6.5 lamellar periods (Lo) showing third- and fifth-order Bragg peaks, (c) thick unannealed film (plotted as XRR x qz4 to display the weak high frequency oscillations in the data), (d) and (e) large area AFM deflection mode images (with inset topography images) depicting surface roughness of annealed films commensurate with 1.5 (d) and 6.5 (e) lamellar periods. (f) AFM topography image of spun-cast film before annealing. These AFM images confirm that the films did not dewet and remained conformal after annealing.

Grahic Jump Location
Fig. 2

(a) Schematic of TDTR film stack for assembled PS-b-PMMA sample with 1.5 lamellar period thickness, (b) example of the TDTR data and corresponding fit on the n = 0.5 (−) annealed sample, and (c) out-of-plane thermal conductivity of annealed (filled circles) and amorphous (filled squares) PS-b-PMMA films compared to that of PMMA spun-cast films (open squares) and homopolymer brushes (open circles)

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