There is a clear need for cooling high heat flux generating electronic devices using a dielectric fluid without using a pump. This paper explores the feasibility of employing ethanol as a dielectric fluid in a horizontal, open microchannel heat sink configuration with a tapered gap manifold to yield very low pressure head requirements. The paper presents experimental results for such a system utilizing ethanol as a working fluid under gravity-driven flow. A heat flux of 217 W/cm2 was dissipated with a pressure drop of only 9 kPa. The paper further presents parametric trends regarding flow rate and pressure drop characteristics that provide basic insight into designing high heat flux systems under a given gravity head requirement. Based on the results, interrelationships and design guidelines are developed for the taper, ethanol flow rate and imposed heat flux on heat transfer coefficient and gravity head requirement for electronics cooling. Reducing flow instability, reducing pressure drop, and enhancing heat transfer performance for a dielectric fluid will enable the development of pumpless cooling solutions in a variety of electronics cooling applications.