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Research Papers: Evaporation, Boiling, and Condensation

Electrohydrodynamic Conduction Pumping-Driven Liquid Film Flow Boiling on Bare and Nanofiber-Enhanced Surfaces

[+] Author and Article Information
Viral K. Patel

Multi-Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609
e-mail: patelvk@ornl.gov

Jamal Seyed-Yagoobi

Multi-Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609

Suman Sinha-Ray

Multiscale Mechanics
and Nanotechnology Laboratory,
Department of Mechanical
and Industrial Engineering,
University of Illinois at Chicago,
Chicago, IL 60607

Sumit Sinha-Ray

Multiscale Mechanics and
Nanotechnology Laboratory,
Department of Mechanical
and Industrial Engineering,
University of Illinois at Chicago,
Chicago, IL 60607

Alexander Yarin

Multiscale Mechanics and
Nanotechnology Laboratory,
Department of Mechanical and
Industrial Engineering,
University of Illinois at Chicago,
Chicago, IL 60607

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received February 12, 2015; final manuscript received October 20, 2015; published online December 29, 2015. Assoc. Editor: Amitabh Narain.

J. Heat Transfer 138(4), 041501 (Dec 29, 2015) (8 pages) Paper No: HT-15-1116; doi: 10.1115/1.4032021 History: Received February 12, 2015; Revised October 20, 2015

Liquid film flow boiling heat transfer driven by electrohydrodynamic (EHD) conduction pumping is experimentally studied on a surface with a novel metal-plated nanofiber-mat coating. The nanotextured surface is formed on a copper substrate covered by an electrospun polymer nanofiber mat, which is copper-plated as a postprocess. The mat has a thickness of about 30 μm and is immersed in saturated HCFC-123. The objective is to study electrowetting of the copper-plated nanofiber-enhanced surface via EHD conduction pumping mechanism for the entire liquid film flow boiling regime leading up to critical heat flux (CHF), and compare it to the bare surface without EHD-driven flow. The results show that with the combination of these two techniques, for a given superheat value, enhancement in heat flux and boiling heat transfer coefficient is as high as 555% compared to the bare surface. The results are quite promising for thermal management applications.

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References

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Figures

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Fig. 1

EHD-driven liquid film flow boiling concept

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Fig. 2

Electrode disk with bare surface copper heater

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Fig. 3

Schematic showing electrode dimensions and spacing between electrode pairs

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Fig. 4

Heater assembly showing copper heater piece installed in Delrin insulator

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Fig. 5

SEM image of a copper-plated nanofiber mat

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Fig. 6

Top view (top) and side view (bottom) of experiment housing showing fluid, sensor and electrical connections

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Fig. 7

Liquid film flow boiling for bare and enhanced surfaces with and without EHD conduction pumping

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Fig. 8

Lower heat flux portion of Fig. 7

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Fig. 9

Boiling heat transfer coefficient for bare and enhanced surfaces with and without EHD conduction pumping

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