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Research Papers: Evaporation, Boiling, and Condensation

Combined Dielectrophoretic and Electrohydrodynamic Conduction Pumping for Enhancement of Liquid Film Flow Boiling

[+] Author and Article Information
Viral K. Patel

Multi Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609
e-mail: vkpatel@wpi.edu

Jamal Seyed-Yagoobi

Multi Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609
e-mail: jyagoobi@wpi.edu

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received December 13, 2015; final manuscript received January 2, 2017; published online February 28, 2017. Assoc. Editor: Debjyoti Banerjee.

J. Heat Transfer 139(6), 061502 (Feb 28, 2017) (9 pages) Paper No: HT-15-1786; doi: 10.1115/1.4035709 History: Received December 13, 2015; Revised January 02, 2017

This paper extends previous liquid film flow boiling studies by including the effect of an additional electrohydrodynamic (EHD) force, namely, the dielectrophoretic (DEP) force. Rather than using only EHD conduction pumping of the liquid film to electro-wet the heater surface, a localized nonuniform electric field above the heater surface is established to generate a DEP force for improved vapor bubble extraction during the nucleate boiling regime. The effects of liquid film height and applied potential are studied as a function of heater superheat and heat flux. A brief analytical study is also used to estimate the expected DEP force magnitude to explain the results. All of the above studies are also used to quantify the enhancement in heat transfer that can be achieved when heat transport systems are driven or augmented by these two EHD mechanisms. The results show remarkable enhancement of up to 1217% in boiling heat transfer coefficient at a given superheat when both mechanisms are used simultaneously. The experimental data are important for applications in thermal management in terrestrial and space conditions.

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Figures

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Fig. 1

Concept of liquid film flow boiling with combined EHD conduction and DEP force

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Fig. 2

Schematic showing electrode dimensions and spacing between electrode pairs (only ¼ of the full circle is illustrated)

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Fig. 3

Stainless steel DEP electrode design

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Fig. 4

Heater assembly showing copper heater piece installed in Delrin insulator

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Fig. 5

Cross section of experiment housing showing two chambers separated by interface plate

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Fig. 6

DEP electrode installed in liquid film flow boiling experiment

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Fig. 7

Experimental data and correlation prediction for combined EHD-pumping and DEP-enhanced liquid film flow boiling/pool boiling

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Fig. 8

Low heat flux data for all the cases from Fig. 7 (excluding correlation predictions)

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Fig. 9

Heater/DEP electrode geometry

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Fig. 10

Four x-locations for electric field calculations

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Fig. 11

Square of electric field magnitude along y-axis at various x-locations

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Fig. 12

Estimation of DEP force magnitude along y-axis at various x-locations versus buoyancy force for 0.5 mm bubble diameter

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