Research Papers: Evaporation, Boiling, and Condensation

Combined Dielectrophoretic and Electrohydrodynamic Conduction Pumping for Enhancement of Liquid Film Flow Boiling

[+] Author and Article Information
Viral K. Patel

Multi Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609
e-mail: vkpatel@wpi.edu

Jamal Seyed-Yagoobi

Multi Scale Heat Transfer Laboratory,
Department of Mechanical Engineering,
Worcester Polytechnic Institute,
Worcester, MA 01609
e-mail: jyagoobi@wpi.edu

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received December 13, 2015; final manuscript received January 2, 2017; published online February 28, 2017. Assoc. Editor: Debjyoti Banerjee.

J. Heat Transfer 139(6), 061502 (Feb 28, 2017) (9 pages) Paper No: HT-15-1786; doi: 10.1115/1.4035709 History: Received December 13, 2015; Revised January 02, 2017

This paper extends previous liquid film flow boiling studies by including the effect of an additional electrohydrodynamic (EHD) force, namely, the dielectrophoretic (DEP) force. Rather than using only EHD conduction pumping of the liquid film to electro-wet the heater surface, a localized nonuniform electric field above the heater surface is established to generate a DEP force for improved vapor bubble extraction during the nucleate boiling regime. The effects of liquid film height and applied potential are studied as a function of heater superheat and heat flux. A brief analytical study is also used to estimate the expected DEP force magnitude to explain the results. All of the above studies are also used to quantify the enhancement in heat transfer that can be achieved when heat transport systems are driven or augmented by these two EHD mechanisms. The results show remarkable enhancement of up to 1217% in boiling heat transfer coefficient at a given superheat when both mechanisms are used simultaneously. The experimental data are important for applications in thermal management in terrestrial and space conditions.

Copyright © 2017 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Fig. 1

Concept of liquid film flow boiling with combined EHD conduction and DEP force

Grahic Jump Location
Fig. 2

Schematic showing electrode dimensions and spacing between electrode pairs (only ¼ of the full circle is illustrated)

Grahic Jump Location
Fig. 3

Stainless steel DEP electrode design

Grahic Jump Location
Fig. 4

Heater assembly showing copper heater piece installed in Delrin insulator

Grahic Jump Location
Fig. 5

Cross section of experiment housing showing two chambers separated by interface plate

Grahic Jump Location
Fig. 6

DEP electrode installed in liquid film flow boiling experiment

Grahic Jump Location
Fig. 7

Experimental data and correlation prediction for combined EHD-pumping and DEP-enhanced liquid film flow boiling/pool boiling

Grahic Jump Location
Fig. 8

Low heat flux data for all the cases from Fig. 7 (excluding correlation predictions)

Grahic Jump Location
Fig. 9

Heater/DEP electrode geometry

Grahic Jump Location
Fig. 10

Four x-locations for electric field calculations

Grahic Jump Location
Fig. 11

Square of electric field magnitude along y-axis at various x-locations

Grahic Jump Location
Fig. 12

Estimation of DEP force magnitude along y-axis at various x-locations versus buoyancy force for 0.5 mm bubble diameter




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In