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Research Papers: Micro/Nanoscale Heat Transfer

Nano-Phase Change Materials for Electronics Cooling Applications

[+] Author and Article Information
Laura Colla

Istituto per le Tecnologie della Costruzione,
CNR,
Corso Stati Uniti, 4,
Padova 35127, Italy
e-mail: laura_colla@libero.it

Davide Ercole

Dipartimento di Ingegneria Industriale
e dell'Informazione,
Università degli Studi della Campania
“Luigi Vanvitelli,”
Via Roma 29,
Aversa 81031, Italy
e-mail: davide.ercole@unicampania.it

Laura Fedele

Istituto per le Tecnologie della Costruzione,
CNR,
Corso Stati Uniti, 4,
Padova 35127, Italy
e-mail: fedele@itc.cnr.it

Simone Mancin

Fellow ASME
Department of Management and Engineering,
University of Padova,
Stradella S. Nicola, 1,
Vicenza 36100, Italy
e-mail: simone.mancin@unipd.it

Oronzio Manca

Dipartimento di Ingegneria Industriale
e dell’Informazione,
Università degli Studi della Campania
“Luigi Vanvitelli,”
Via Roma 29,
Aversa 81031, Italy
e-mail: oronzio.manca@unicampania.it

Sergio Bobbo

Istituto per le Tecnologie della Costruzione,
CNR,
Corso Stati Uniti, 4,
Padova 35127, Italy
e-mail: bobbo@itc.cnr.it

1Corresponding author.

Presented at the 2016 ASME 5th Micro/Nanoscale Heat & Mass Transfer International Conference. Paper No. MNHMT2016-6613.Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received June 1, 2016; final manuscript received January 10, 2017; published online March 7, 2017. Assoc. Editor: Zhuomin Zhang.

J. Heat Transfer 139(5), 052406 (Mar 07, 2017) (9 pages) Paper No: HT-16-1344; doi: 10.1115/1.4036017 History: Received June 01, 2016; Revised January 10, 2017

The present work aims at investigating a new challenging use of aluminum oxide (Al2O3) nanoparticles to enhance the thermal properties (thermal conductivity, specific heat, and latent heat) of pure paraffin waxes to obtain a new class of phase change materials (PCMs), the so-called nano-PCMs. The nano-PCMs were obtained by seeding 0.5 and 1.0 wt  % of Al2O3 nanoparticles in two paraffin waxes having melting temperatures of 45 and 55 °C, respectively. The thermophysical properties such as specific heat, latent heat, and thermal conductivity were then measured to understand the effects of the nanoparticles on the thermal properties of both the solid and liquid PCMs. Furthermore, a numerical comparison between the use of the pure paraffin waxes and the nano-PCMs obtained in a typical electronics passive cooling device was developed and implemented. A numerical model is accomplished to simulate the heat transfer inside the cavity either with PCM or nano-PCM. Numerical simulations were carried out using the ansys-fluent 15.0 code. Results in terms of solid and liquid phase fractions and temperatures and melting time were reported and discussed. They showed that the nano-PCMs determine a delay in the melting process with respect to the pure PCMs.

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References

Figures

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Fig. 1

Hot disk sensor (a), thermal conductivity setup (b), and differential scanning calorimeter, detailed calorimetric cells (c)

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Fig. 2

Specific heat capacity of paraffin waxes RT55 and its nano-PCMs, as a function of temperature

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Fig. 3

Effect of Al2O3 nanoparticles on the latent heat of RT55 paraffin wax as a function of the nanoparticles' concentration

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Fig. 4

Simulated two-dimensional domain

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Fig. 5

The numerical grid

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Fig. 6

Comparison between the two pure paraffin waxes in term of mean values of liquid fraction as a function of the time at 10 W

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Fig. 7

Comparison between the two pure paraffin waxes in term of mean values of temperature as a function of the time at 10 W

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Fig. 8

Comparison between the two nano-PCMs 0.5% in term of (a) mean values of liquid fraction and (b) mean temperature, as a function of the time at 10 W

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Fig. 9

Comparison between the two nano-PCMs 1.0% in term of (a) mean values of liquid fraction and (b) mean temperature as a function of the time at 10 W

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Fig. 10

Values of liquid fraction for the pure PCM and its nano-PCMs at different heat flow rates: (a) RT45 and (b) RT55

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Fig. 11

Maximum junction temperature for the pure PCM and its nano-PCMs at different heat flow rates: (a) RT45 and (b) RT55

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