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research-article

Microscale Morphology Effects of Copper-Graphene Oxide Coatings on Pool Boiling Characteristics

[+] Author and Article Information
Arvind Jaikumar

Microsystems Engineering Department, Rochester Institute of Technology 76 Lomb Memorial Dr., Rochester, NY, 14623, U.S.A
aj4853@rit.edu

Aniket Rishi

Mechanical Engineering Department, Rochester Institute of Technology 76 Lomb Memorial Dr., Rochester, NY, 14623, U.S.A
amr6756@rit.edu

Anju Gupta

Chemical Engineering Department, Rochester Institute of Technology 76 Lomb Memorial Dr., Rochester, NY, 14623, U.S.A
argche@rit.edu

Satish G. Kandlikar

Mechanical Engineering Department Microsystems Engineering Department Rochester Institute of Technology 76 Lomb Memorial Dr., Rochester, NY, 14623, U.S.A
sgkeme@rit.edu

1Corresponding author.

ASME doi:10.1115/1.4036695 History: Received October 26, 2016; Revised March 09, 2017

Abstract

Enhanced pool boiling heat transfer, with simultaneous increase in both critical heat flux (CHF) and heat transfer coefficient (HTC), is desired to improve overall system efficiency and reduce equipment size and cost. This paper focuses on different techniques associated with generating enhancement structures based on their ability to enhance HTC, CHF or both. Three pool boiling performance characteristics based on CHF improvements and wall superheat reductions are identified: Type I - reduction in wall superheat only, Type II - increase in CHF only, and Type III - increase in CHF with reduction in wall superheat. Specific microscale morphologies were generated with copper and Graphene oxide coatings using (a) screen-printing and (b) electrodeposition techniques. In Type-I, rapid bubble activity due to increased availability of nucleation cavities was seen to influence the reduction in the wall superheats while no increase in CHF was noted. Roughness augmented wettability was found to be the driving mechanism in Type-II enhancement while wicking and increased nucleation site density were responsible for enhancement in Type-III. An HTC enhancement of ~216% in Type-I and a CHF improvement of ~70% in Type-II were achieved when compared to a plain copper surface with water. In Type-III enhancement, a record CHF of 2.2 MW/m2 (1.8X over a plain surface) with an HTC of 155 kW/m2°C (~2.4X over a plain surface) was obtained. Furthermore, close correlations between the boiling performance and the microscale surface morphology in these three categories have been identified.

Copyright (c) 2017 by ASME
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