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research-article

Heat conduction and thermo-elastic stress field disturbed by a thermal-medium crack propagating in orthotropic materials characterized by real or complex eigenvalues

[+] Author and Article Information
Yue-Ting Zhou

School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, P. R. China
zhouyt@hanyang.ac.kr

Tae-Won Kim

School of Mechanical Engineering, Hanyang University, Seoul 133-791, Republic of Korea
twkim@hanyang.ac.kr

1Corresponding author.

ASME doi:10.1115/1.4036981 History: Received March 04, 2016; Revised May 27, 2017

Abstract

A dynamic, partially permeable crack model for orthotropic materials is established with the crack full of thermal medium. Besides external thermal and elastic loadings, the heat flux of the crack interior depending on the crack opening displacement is applied on the crack surfaces. Thus, the heat conduction is dependent on elastic field. First, the heat conduction equation is solved exactly in terms of unknown heat flux of the crack interior. Then, the elastic field is presented for real or complex eigenvalues cases on the basis of the operator theory. Finally, the thermal and elastic fields are presented analytically, and the heat flux of the crack interior is determined explicitly. Numerical results are offered to show the influences of the thermal conductivity coefficient, normal and shear loadings and crack velocity on the distributions of the heat flux, temperature difference across the crack surfaces and thermal stress intensity factor. Figures illustrate that increasing the crack velocity leads to a more thermally impermeable crack and produces a bigger temperature difference across the crack surfaces.

Copyright (c) 2017 by ASME
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