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research-article

Modeling of Flow Boiling in Microchannel with Non-Uniform Wall Heat Flux

[+] Author and Article Information
Daniel Lorenzini

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Dr, Atlanta, GA 30332, United States
lorenzini@gatech.edu

Yogendra Joshi

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Dr, Atlanta, GA 30332, United States
yogendra.joshi@me.gatech.edu

1Corresponding author.

ASME doi:10.1115/1.4037343 History: Received June 03, 2016; Revised May 15, 2017

Abstract

The computational fluid dynamics (CFD) modeling of boiling phenomena has remained a challenge due to numerical limitations for accurately simulating the two-phase flow and phase-change processes. In the present investigation, a CFD approach for such analysis is described using a three-dimensional (3D) Volume of Fluid (VOF) model coupled with a phase-change model accounting for the interfacial mass and energy transfer. This type of modeling allows the transient analysis of flow boiling mechanisms, while providing the ability to visualize in detail temperature, phase, and pressure distributions for microscale applications with affordable computational resources. Results for a plain microchannel are validated against benchmark correlations for heat transfer coefficients and pressure drop as a function of the heat flux and mass flux. Furthermore, the model is used for the assessment of two-phase cooling in microelectronics under a realistic scenario with non-uniform heat fluxes at localized regions of a silicon microchannel, relevant to the cooling layer of 3D integrated circuit (IC) architectures. Results indicate the strong effect of two-phase flow regime evolution and vapor accumulation on heat transfer. The effects of reduced saturation pressure, subcooling and flow arrangement are explored in order to provide insight about the underlying physics and cooling performance.

Copyright (c) 2017 by ASME
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