Technical Brief

Synthesis and Thermal Properties of Magnesium Sulfate Heptahydrate/Urea Resin as Thermal Energy Storage Micro-Encapsulated Phase Change Material

[+] Author and Article Information
Chenzhen Liu, Ling Ma, Yimin Li

School of Electrical and Power Engineering,
China University of Mining and Technology,
Xuzhou 221116, China

Zhonghao Rao

School of Electrical and Power Engineering,
China University of Mining and Technology,
Xuzhou 221116, China
e-mail: raozhonghao@cumt.edu.cn

1Corresponding author.

Paper presented at the 5th ASME 2016 Micro/Nanoscale Heat & Mass Transfer International Conference. Paper No. MNHMT2016-6344.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received May 30, 2016; final manuscript received April 19, 2017; published online August 16, 2017. Assoc. Editor: Zhuomin Zhang.

J. Heat Transfer 140(1), 014501 (Aug 16, 2017) (5 pages) Paper No: HT-16-1329; doi: 10.1115/1.4037340 History: Received May 30, 2016; Revised April 19, 2017

In this study, micro-encapsulated phase change material (microPCM) was successfully synthesized by emulsion polymerization method, using magnesium sulfate heptahydrate (MSH) as core material and urea resin (UR) as shell material. The surface morphologies and particle size distributions of the microPCM were tested by scanning electron microscopy (SEM) and laser particle size analyzer. The chemical structure of microPCM was analyzed by Fourier-transform infrared spectroscopy (FTIR). The thermal properties were investigated by differential scanning calorimetry (DSC) and thermal conductivity coefficient instrument, respectively.

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Grahic Jump Location
Fig. 1

Schematic of micro-encapsulation theory

Grahic Jump Location
Fig. 2

SEM micrographs of MSH/UR microPCM: (a) S1, (b) S2, (c) S3, and (d) S4

Grahic Jump Location
Fig. 3

Particle size distribution of MSH/UR microPCM: (a) S1, (b) S2, (c) S3, and (d) S4

Grahic Jump Location
Fig. 4

FTIR spectra of UR, MSH, and microPCM

Grahic Jump Location
Fig. 5

DSC curves of MSH and microPCM

Grahic Jump Location
Fig. 6

Thermal conductivities of MSH and microPCM with different temperatures



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