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research-article

Evaporating Heat Transfer in Thin Film Region

[+] Author and Article Information
Benwei Fu

Institute of Marine Engineering and Thermal Science, College of Marine Engineering, Dalian Maritime University, Dalian, 116026, China
845744877@qq.com

NanNan Zhao

Institute of Marine Engineering and Thermal Science, College of Marine Engineering, Dalian Maritime University, Dalian, 116026, China
znn@dlmu.edu.cn

Bohan Tian

Institute of Marine Engineering and Thermal Science, College of Marine Engineering, Dalian Maritime University, Dalian, 116026, China
tianbohan@163.com

Wilson Corey

Institute of Marine Engineering and Thermal Science, College of Marine Engineering, Dalian Maritime University, Dalian, 116026, China
cwilson9@gmail.com

Hongbin Ma

Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, Missouri, USA
mah@missouri.edu

1Corresponding author.

ASME doi:10.1115/1.4037448 History: Received July 09, 2016; Revised April 13, 2017

Abstract

Thin film evaporation can result in an extra high evaporating heat transfer coefficient. In the current investigation, a mathematical model was developed to consider the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin film region of an evaporating meniscus. The model is based on the momentum conservation equation for fluid flow in the thin film region. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin film profile, interfacial temperature, heat flux distribution, velocity distribution, mass flow rate, and meniscus radius in the evaporating thin film region. The interfacial thermal resistance occurring at the liquid vapor interface significantly affects fluid flow and heat transfer in the evaporating thin film region.

Copyright (c) 2017 by ASME
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