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research-article

Investigation of the Use of an Inorganic Aqueous Solution (IAS) in Copper Made Phase Change Heat Transfer Devices

[+] Author and Article Information
Qi Yao

University of California, Los Angeles 420 Westwood Plaza, Eng. IV 43-132 Los Angeles, CA 90095-1957
yaoqi1983@ucla.edu

Jacob Supowit

University of California, Los Angeles 420 Westwood Plaza, Eng. IV 43-132 Los Angeles, CA 90095-1957
jake.supowit@gmail.com

Dr. Ivan Catton

University of California, Los Angeles 420 Westwood Plaza, Eng. IV 43-132 Los Angeles, CA 90095-1957
catton@ucla.edu

1Corresponding author.

ASME doi:10.1115/1.4038190 History: Received August 05, 2016; Revised August 21, 2017

Abstract

A novel Inorganic Aqueous Solution (IAS) is shown to have a better heat transfer performance than water when used as the working fluid in copper made phase change heat transfer devices. First, the physical properties of IAS are measured and compared to those of water. Another, a chemical analysis is performed, and the chemical reactions involved between IAS and the copper surface are listed and categorized by their contributions to the heat transfer performance. In addition, a capillary rise test is performed to show how each chemical contributes to the improvement of the surface wettability. Last, using IAS in copper made phase change heat transfer devices is discussed, and the main focus is how IAS improves the heat transfer performance by a smaller thermal resistance and a larger critical heat flux. The conclusion is validated by thermo-syphon tests at different inclination angles.

Copyright (c) 2017 by ASME
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