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Technical Brief

Molecular Dynamic Study of Boiling Heat Transfer over Structured Surfaces

[+] Author and Article Information
Saikat Mukherjee

Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee; Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee-247667, India
saikatmukherjeeiitr@gmail.com

Saikat Datta

Department of Mechanical Engineering, Indian Institute of Technology Kharagpur, Department of Mechanical Engineering, IIT Kharagpur, Kharagpur-721302, India
saikat.mech@gmail.com

Arup Kumar Das

Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee; Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee-247667, India
arupdas80@gmail.com

1Corresponding author.

ASME doi:10.1115/1.4038480 History: Received May 13, 2017; Revised September 18, 2017

Abstract

A Phase change heat transfer from liquid to gas is studied in nanoscopic framework using molecular dynamics. Water on structured Si substrate is observed from molecular viewpoint after employing heat flux at a constant rate. Initially, we observe that water settles down on the substrate occupying the free space within the notch to obtain its static shape maintaining intra molecular configuration based on attractive and repulsive forces in neighboring hydroxyl bonds. Upon applying heat flux we observe that molecular vibration increases which repels neighbors to make the packing loose. Molecular dilution initiated at the notch and then proceeds to the rest domain. Progressive loosening of the molecules leads to the formation of vapor bubbles which increase in size with time. The rate of growth of this bubble is studied as a function of surface geometry parameters such as notch height, notch width, notch type and notch spacing. Present simulations enrich the knowledge of surface characteristics on boiling heat transfer from fundamental principle in the molecular domain.

Copyright (c) 2017 by ASME
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