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research-article

Spreading Resistance in Compound Orthotropic Flux Channel with Different Conductivities in the Three Spatial Directions

[+] Author and Article Information
Belal Al-Khamaiseh

Department of Mathematics and Statistics, Memorial University of Newfoundland, St. John's, NL, Canada, A1C 5S7
balkhamaiseh@mun.ca

Y. S. Muzychka

Professor, Fellow ASME, Department of Mechanical Engineering, Memorial University of Newfoundland, St. John's, NL, Canada, A1B 3X5
y.s.muzychka@gmail.com

Serpil Kocabiyik

Professor, Department of Mathematics and Statistics, Memorial University of Newfoundland, St. John's, NL, Canada, A1C 5S7
serpil@mun.ca

1Corresponding author.

ASME doi:10.1115/1.4038712 History: Received April 24, 2017; Revised October 29, 2017

Abstract

In the microelectronics industry, the multilayer structures are found extensively where the microelectronic device/system is manufactured as a compound system of different materials. Recently, a variety of new materials have emerged in the microelectronics industry with properties superior to Silicon, enabling new devices with extreme performance. Such materials include ??-Gallium-oxide (??-Ga2O3 ), and Black Phosphorus (BP), which are acknowledged to have anisotropic thermal conductivity tensors. In many of these devices, thermal issues due to self-heating are a problem that affect the performance, efficiency, and reliability of the devices. Analytical solutions to the heat conduction equation in such devices with anisotropic thermal conductivity tensor offer significant computational savings over numerical methods. In this paper, general analytical solutions of temperature distribution and thermal resistance of a multilayered orthotropic system are obtained. The system is considered as a compound three dimensional flux channel consisting of N-layers with different thermal conductivities in the three spatial directions in each layer. A single eccentric heat source is considered in the source plane while a uniform heat transfer coefficient is considered along the sink plane. The solutions account for the effect of interfacial conductance between the layers and for considering multiple eccentric heat sources in the source plane. For validation purposes, the analytical results are compared with numerical solution results obtained by solving the problem with the Finite Element Method (FEM) using ANSYS commercial software package.

Copyright (c) 2017 by ASME
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