Constructal Placement of the Heat Sources with Different Lengths in an Electronic Package

[+] Author and Article Information
Bugra Sarper

Gumushane University Department of Mechanical Engineering, 29100 Gumushane, Turkey

Mehmet Saglam

Karadeniz Technical University Department of Mechanical Engineering, 61080 Trabzon, Turkey

Dr. Orhan Aydin

Karadeniz Technical University Department of Mechanical Engineering, 61080 Trabzon, Turkey

1Corresponding author.

ASME doi:10.1115/1.4041187 History: Received April 14, 2018; Revised August 02, 2018


In this study, convective heat transfer in a discretely heated parallel-plate vertical channel which simulates an IC package is investigated experimentally and numerically. Both natural and mixed convection cases are considered. The primary focus of the study is on determining optimum relative lengths of the heat sources in order to reduce the hot spot temperature and to maximize heat transfer from the sources to the air. Various values of the length ratio and the modified Grashof number (for the natural convection case) / the Richardson number (for the mixed convection case) are examined. Conductive and radiative heat transfer is included in the analysis while air is used as the working fluid. Surface temperatures of the heat sources and the channel walls are measured in the experimental study. The numerical studies are performed using a commercial CFD code, ANSYS FLUENT. The variations of surface temperature, hot spot temperature, Nusselt number and global conductance of the system are obtained for varying values of the working parameters.

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