0
research-article

Thermal Performance of Microelectronic Substrates with Sub-mm Integrated Vapor Chamber

[+] Author and Article Information
Sangbeom Cho

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Drive, Atlanta, GA 30332
scho84@gatech.edu

Yogendra Joshi

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Drive, Atlanta, GA 30332
yogendra.joshi@me.gatech.edu

1Corresponding author.

ASME doi:10.1115/1.4042328 History: Received September 01, 2018; Revised December 11, 2018

Abstract

We develop a vapor chamber integrated with microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two different prototype vapor chambers with different micropillar array designs are fabricated, and the thermal performances of the devices are tested under various heat inputs supplied from 2 mm × 2 mm heat source. Test results show that thermal performance of the device increases as the power increases, and the maximum thermal performance of the prototype improves by ~20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer numerical model of the vapor chamber, coupled with conduction model of the packaging substrate is developed, and the results are compared with test data.

Copyright (c) 2018 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In