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Proceedings Papers

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
https://doi.org/10.1115/IPACK2023-112061
View Paper titled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
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Topics: Additive manufacturing, Adhesives, Electronics, Flexible electronics, Printing, Surface mount devices, Sustainability
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
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Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
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Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
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Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Pradeep Lall, Shriram Kulkarni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111979
https://doi.org/10.1115/IPACK2023-111979
View Paper titled, Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures
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Topics: Adhesives, Anisotropy, Surface mount devices
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69719
https://doi.org/10.1115/IPACK2021-69719
View Paper titled, Mechanical Behavior of Heat Activated Film Adhesives
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Topics: Adhesives, Heat, Mechanical behavior, Mechanical properties, Phase transitions
Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components
Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
https://doi.org/10.1115/IPACK2021-74060
View Paper titled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
https://doi.org/10.1115/IPACK2021-74073
View Paper titled, Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
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Topics: Adhesives, Filters, Printing, Silver, Sintering
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6541
https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
Open the PDF for Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design in another window
Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6416
https://doi.org/10.1115/IPACK2019-6416
View Paper titled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry