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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Paper No: IPACK2022-97382
DOI: https://doi.org/10.1115/IPACK2022-97382
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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Pradeep Lall, Padmanava Choudhury, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A012, October 25–27, 2022
Paper No: IPACK2022-97448
DOI: https://doi.org/10.1115/IPACK2022-97448
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Topics: Bending (Stress), Cycles, Failure, Fatigue, Fracture (Materials), Fracture (Process), Stress
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Paper No: IPACK2021-74062
DOI: https://doi.org/10.1115/IPACK2021-74062
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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Paper No: IPACK2021-74115
DOI: https://doi.org/10.1115/IPACK2021-74115
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Topics: Batteries, Bending (Stress), Biomedical equipment, Electronics, Flexible electronics, Industrial research, Lithium-ion batteries, Regression models, Stress
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Paper No: IPACK2020-2661
DOI: https://doi.org/10.1115/IPACK2020-2661
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Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Paper No: IPACK2019-6507
DOI: https://doi.org/10.1115/IPACK2019-6507
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Paper No: IPACK2019-6572
DOI: https://doi.org/10.1115/IPACK2019-6572
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Topics: Bending (Stress), Delamination, Electronics, Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Paper No: IPACK2019-6579
DOI: https://doi.org/10.1115/IPACK2019-6579
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Topics: Aerosols, Bending (Stress), Flexible electronics, Reliability
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Paper No: IPACK2017-74322
DOI: https://doi.org/10.1115/IPACK2017-74322
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Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009
Paper No: InterPACK2009-89178
DOI: https://doi.org/10.1115/InterPACK2009-89178
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Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation
Proceedings Papers

Wire Flexure Fatigue Model for Asymmetric Bond Height

Karumbu Nathan Meyyappan, Peter Hansen, Patrick McCluskey
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 769-776, July 6–11, 2003
Paper No: IPACK2003-35136
DOI: https://doi.org/10.1115/IPACK2003-35136
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Topics: Bending (Stress), Fatigue, Wire, Damage, Failure, Stress, Temperature, Cycles, Design, Displacement
Proceedings Papers

Micromirror With Multiple Digitized Angles for Free Space Optical Crossconnects

Jianglong Zhang, Y. C. Lee
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 269-277, July 6–11, 2003
Paper No: IPACK2003-35341
DOI: https://doi.org/10.1115/IPACK2003-35341
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Topics: Microelectromechanical systems, Vacuum, Bending (Stress), Electrodes, Boundary element methods, Design, Electronics, Energy consumption, Finite element methods, Finite element model