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Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Paper No: IPACK2022-94052
DOI: https://doi.org/10.1115/IPACK2022-94052
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Paper No: IPACK2015-48690
DOI: https://doi.org/10.1115/IPACK2015-48690
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Paper No: IPACK2015-48033
DOI: https://doi.org/10.1115/IPACK2015-48033
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks

Amip Shah, Chandrakant D. Patel, Cullen Bash
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 663-671, July 19–23, 2009
Paper No: InterPACK2009-89037
DOI: https://doi.org/10.1115/InterPACK2009-89037
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Topics: Blocks (Building materials), Computers, Design, Sustainability, Heat, Cooling, Linkages, Boundary-value problems, Green design, Life cycle assessment
Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Paper No: InterPACK2009-89032
DOI: https://doi.org/10.1115/InterPACK2009-89032
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Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization
Proceedings Papers

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 353-364, July 17–22, 2005
Paper No: IPACK2005-73242
DOI: https://doi.org/10.1115/IPACK2005-73242
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Topics: Blocks (Building materials), Boundary-value problems, Computer cooling, Cooling, Density, Design, Electrical conductivity, Heat pipes, Heat transfer, Industrial research
Proceedings Papers

Towards Next Generation of Switching

Alex Vukovic, Michel Savoie, Heng Hua
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 25-28, July 6–11, 2003
Paper No: IPACK2003-35043
DOI: https://doi.org/10.1115/IPACK2003-35043
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Topics: Blocks (Building materials), Optoelectronic devices, Storage, Switches, Traffic, Wavelength
Proceedings Papers

The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow

Sukhvinder Kang, Maurice Holahan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 237-244, July 6–11, 2003
Paper No: IPACK2003-35104
DOI: https://doi.org/10.1115/IPACK2003-35104
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Topics: Flow (Dynamics), Heat sinks, Thermal resistance, Fins, Temperature, Blocks (Building materials), Computational fluid dynamics, Engineering simulation, Heat transfer, Heat transfer coefficients