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Proceedings Papers

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 25–27, 2022

Paper No: IPACK2022-92005

DOI: https://doi.org/10.1115/IPACK2022-92005

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Topics: Carbon, Data centers, Energy consumption, Stress, Water

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022

Paper No: IPACK2022-97447

DOI: https://doi.org/10.1115/IPACK2022-97447

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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems

Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021

Paper No: IPACK2021-72682

DOI: https://doi.org/10.1115/IPACK2021-72682

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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases

Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019

Paper No: IPACK2019-6443

DOI: https://doi.org/10.1115/IPACK2019-6443

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Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap

Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018

Paper No: IPACK2018-8436

DOI: https://doi.org/10.1115/IPACK2018-8436

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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software

Proceedings Papers

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

Timothy J. Longson, James Maddocks, Ali Kashani

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A078, July 6–9, 2015

Paper No: IPACK2015-48735

DOI: https://doi.org/10.1115/IPACK2015-48735

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Topics: Multi-walled nanotubes, Contact resistance, Temperature, Heat conduction, Modeling, Carbon, Catalysts, Deformation, Density, Multi-walled carbon nanotubes

Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A011, July 6–9, 2015

Paper No: IPACK2015-48567

DOI: https://doi.org/10.1115/IPACK2015-48567

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Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure

Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013

Paper No: IPACK2013-73130

DOI: https://doi.org/10.1115/IPACK2013-73130

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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion

Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011

Paper No: IPACK2011-52148

DOI: https://doi.org/10.1115/IPACK2011-52148

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Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure

Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo

Paper No: IPACK2011-52169

DOI: https://doi.org/10.1115/IPACK2011-52169

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Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons

Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52062

DOI: https://doi.org/10.1115/IPACK2011-52062

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Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes

Proceedings Papers

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52064

DOI: https://doi.org/10.1115/IPACK2011-52064

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Topics: Carbon, Electrical conductivity, Nanotubes, Resins, Carbon nanotubes, Microwaves, Reflectance, Impedance (Electricity), Stress, Electrical properties

Proceedings Papers

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Cemal Basaran, Tarek Ragab

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 513-516, July 19–23, 2009

Paper No: InterPACK2009-89005

DOI: https://doi.org/10.1115/InterPACK2009-89005

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Topics: Carbon, Damage mechanics, Nanotubes, Tension, Stress, Single-walled carbon nanotubes, Boundary-value problems, Computation, Displacement, Molecular dynamics simulation

Proceedings Papers

An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management

Omar Sanusi, Randy D. Weinstein, Amy S. Fleischer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 529-533, July 19–23, 2009

Paper No: InterPACK2009-89070

DOI: https://doi.org/10.1115/InterPACK2009-89070

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Topics: Carbon, Phase change materials, Thermal management, Transients (Dynamics), Electrical conductivity, Thermal conductivity, Design, Displacement, Heat, Heat conduction

Proceedings Papers

Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

Walter W. Yuen, Jianping Tu, Wai-Cheong Tam, Dan Blumenthal

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 637-645, July 19–23, 2009

Paper No: InterPACK2009-89008

DOI: https://doi.org/10.1115/InterPACK2009-89008

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Topics: Carbon, Cooling, Design, Heat flux, Testing

Proceedings Papers

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 569-574, July 19–23, 2009

Paper No: InterPACK2009-89146

DOI: https://doi.org/10.1115/InterPACK2009-89146

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Topics: Carbon, Nanotubes, Resins, Strain measurement, Carbon nanotubes, Electrical resistance, Waves, Electrical conductivity, Thermal conductivity, Thin films

Proceedings Papers

Reliability of Power Electronic Modules

H. Lu, W. S. Loh, T. Tilford, M. Johnson, C. Bailey

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 883-888, July 8–12, 2007

Paper No: IPACK2007-33817

DOI: https://doi.org/10.1115/IPACK2007-33817

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Topics: Reliability, Aircraft, Carbon, Climate change, Design methodology, Electric vehicles, Electronics, Emissions, Failure, Physics

NARROW

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Comparative Study on Power Module Architectures for Modularity and Scalability

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management

Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Reliability of Power Electronic Modules

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