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Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022

Paper No: IPACK2022-97450

DOI: https://doi.org/10.1115/IPACK2022-97450

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Topics: Circuits, Electronics, Printing

Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022

Paper No: IPACK2022-97430

DOI: https://doi.org/10.1115/IPACK2022-97430

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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat

Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022

Paper No: IPACK2022-97428

DOI: https://doi.org/10.1115/IPACK2022-97428

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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles

Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022

Paper No: IPACK2022-97457

DOI: https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019

Paper No: IPACK2019-6347

DOI: https://doi.org/10.1115/IPACK2019-6347

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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits

Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019

Paper No: IPACK2019-6424

DOI: https://doi.org/10.1115/IPACK2019-6424

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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature

Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019

Paper No: IPACK2019-6434

DOI: https://doi.org/10.1115/IPACK2019-6434

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Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation

Proceedings Papers

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019

Paper No: IPACK2019-6499

DOI: https://doi.org/10.1115/IPACK2019-6499

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Topics: Circuits, Sapphire, Silicon nitride ceramics, Thermal expansion

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018

Paper No: IPACK2018-8300

DOI: https://doi.org/10.1115/IPACK2018-8300

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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling

Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017

Paper No: IPACK2017-74264

DOI: https://doi.org/10.1115/IPACK2017-74264

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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating

Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017

Paper No: IPACK2017-74080

DOI: https://doi.org/10.1115/IPACK2017-74080

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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods

Proceedings Papers

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A028, July 6–9, 2015

Paper No: IPACK2015-48308

DOI: https://doi.org/10.1115/IPACK2015-48308

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Topics: Heat, Heat pipes, Heat transfer, Thermal conductivity, Water, Circuits, Condensers (steam plant), Copper powders, Dimensions, Fluids

Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015

Paper No: IPACK2015-48744

DOI: https://doi.org/10.1115/IPACK2015-48744

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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation

Proceedings Papers

Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics

Kaustubh Nagarkar, Craig Galligan, Michael Klitzke, James Rose, Binoy Shah, Donna Sherman

Paper No: IPACK2015-48704

DOI: https://doi.org/10.1115/IPACK2015-48704

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Topics: Biomedicine, Electronics, Packaging, Circuits, Laminates, Manufacturing, Microelectromechanical systems, Pressure sensors, Sensors

Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer

Paper No: IPACK2015-48811

DOI: https://doi.org/10.1115/IPACK2015-48811

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Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling

Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Jingshi Meng, Abhijit Dasgupta

Paper No: IPACK2015-48669

DOI: https://doi.org/10.1115/IPACK2015-48669

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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems

Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer

Paper No: IPACK2015-48049

DOI: https://doi.org/10.1115/IPACK2015-48049

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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits

Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Prabjit Singh

Paper No: IPACK2015-48180

DOI: https://doi.org/10.1115/IPACK2015-48180

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Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics

NARROW

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

State of the Art of Electronics Cooling for Radar Antenna Applications

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

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