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Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Paper No: IPACK2022-97218
DOI: https://doi.org/10.1115/IPACK2022-97218
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Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Paper No: IPACK2022-97186
DOI: https://doi.org/10.1115/IPACK2022-97186
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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Paper No: IPACK2021-68121
DOI: https://doi.org/10.1115/IPACK2021-68121
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
DOI: https://doi.org/10.1115/IPACK2019-6391
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Paper No: IPACK2018-8253
DOI: https://doi.org/10.1115/IPACK2018-8253
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A019, August 27–30, 2018
Paper No: IPACK2018-8394
DOI: https://doi.org/10.1115/IPACK2018-8394
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Topics: Finite element analysis, Stress analysis (Engineering), Design, Temperature, Stress, Modeling, Thermal stresses, Computation, Convection, Flat heat pipes
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Paper No: IPACK2017-74278
DOI: https://doi.org/10.1115/IPACK2017-74278
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Edge Computing and Contextual Information for the Internet of Things Sensors

Lavanya Turlapati, Nigel Hinds, Dhruv Nair, Levente J. Klein
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, August 29–September 1, 2017
Paper No: IPACK2017-74304
DOI: https://doi.org/10.1115/IPACK2017-74304
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Topics: Internet of things, Sensors, Wind, Computation, Internet, Methane, Modeling, Plumes (Fluid dynamics), Sensor placement, Signals
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Paper No: IPACK2017-74208
DOI: https://doi.org/10.1115/IPACK2017-74208
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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Paper No: IPACK2015-48785
DOI: https://doi.org/10.1115/IPACK2015-48785
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Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015
Paper No: IPACK2015-48085
DOI: https://doi.org/10.1115/IPACK2015-48085
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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation
Proceedings Papers

Harvesting CPU Waste Heat Through Pyroelectric Materials

Soochan Lee, Nishant Singh, Patrick E. Phelan, Carole-Jean Wu
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A079, July 6–9, 2015
Paper No: IPACK2015-48421
DOI: https://doi.org/10.1115/IPACK2015-48421
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Topics: Waste heat, Heat, Temperature, Materials properties, Thermal conductivity, Computation, Electric power generation, Energy dissipation, Energy efficiency, Energy generation
Proceedings Papers

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015
Paper No: IPACK2015-48205
DOI: https://doi.org/10.1115/IPACK2015-48205
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Topics: Boundary-value problems, Silicon, Temperature, Thermal resistance, Computation, Heat conduction, Heat transfer, Simulation results, Design, Electronic equipment
Proceedings Papers

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Paper No: IPACK2015-48568
DOI: https://doi.org/10.1115/IPACK2015-48568
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Topics: Hardware, Temperature, Phase change materials, Thermal management, Complementary metal oxide semiconductors, Computation, Cooling, Design, Errors, Heat
Proceedings Papers

Measured-Temperature Interpolation and Visualization for Data Centers

Xuanhang (Simon) Zhang, Christopher M. Healey, Zachary R. Sheffer, James W. VanGilder
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A006, July 16–18, 2013
Paper No: IPACK2013-73081
DOI: https://doi.org/10.1115/IPACK2013-73081
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Topics: Data centers, Interpolation, Temperature, Visualization, Cooling, Temperature sensors, Computation, Computational fluid dynamics, Fluid dynamics, Maintenance
Proceedings Papers

Prediction of Hot Aisle Partition Airflow Boundary Conditions

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A002, July 16–18, 2013
Paper No: IPACK2013-73049
DOI: https://doi.org/10.1115/IPACK2013-73049
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Topics: Air flow, Boundary-value problems, Artificial neural networks, Computational fluid dynamics, Data centers, Computation, Flow (Dynamics), Server racks, Computer software, Design
Proceedings Papers

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 647-652, July 6–8, 2011
Paper No: IPACK2011-52276
DOI: https://doi.org/10.1115/IPACK2011-52276
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Topics: Circuits, Design, Simulation, Capacitors, Complementary metal oxide semiconductors, Computation, Electromagnetic force, Electromagnetism, Inductors, Resistors
Proceedings Papers

Thermoelectric Cooling Analysis Using Modified Graphical Method

Huy N. Phan, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 33-37, July 19–23, 2009
Paper No: InterPACK2009-89077
DOI: https://doi.org/10.1115/InterPACK2009-89077
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Topics: Thermoelectric cooling, Computation, Computational fluid dynamics, Cooling, Cooling systems, Currents, Design, Fluids, Temperature, Thermoelectric coolers
Proceedings Papers

Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method

Je-Hyoung Park, Ali Shakouri, Sung-Mo Kang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 701-707, July 19–23, 2009
Paper No: InterPACK2009-89072
DOI: https://doi.org/10.1115/InterPACK2009-89072
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Topics: Complementary metal oxide semiconductors, Computation, Computer software, Design, Energy dissipation, Errors, Finite element analysis, Heat, Integrated circuits, Optimization