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Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
DOI: https://doi.org/10.1115/IPACK2022-97443
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Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Paper No: IPACK2022-97421
DOI: https://doi.org/10.1115/IPACK2022-97421
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Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Paper No: IPACK2022-97402
DOI: https://doi.org/10.1115/IPACK2022-97402
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Paper No: IPACK2022-97481
DOI: https://doi.org/10.1115/IPACK2022-97481
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Paper No: IPACK2022-97416
DOI: https://doi.org/10.1115/IPACK2022-97416
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Paper No: IPACK2022-97445
DOI: https://doi.org/10.1115/IPACK2022-97445
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Topics: Computational fluid dynamics, Cooling, Heat
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Paper No: IPACK2022-97447
DOI: https://doi.org/10.1115/IPACK2022-97447
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Paper No: IPACK2021-72976
DOI: https://doi.org/10.1115/IPACK2021-72976
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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

Pardeep Shahi, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 27–29, 2020
Paper No: IPACK2020-2592
DOI: https://doi.org/10.1115/IPACK2020-2592
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Topics: Computational fluid dynamics, Copper, Data centers, Nanoparticles
Proceedings Papers

Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics

Darryl Jennings, Jr., Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 27–29, 2020
Paper No: IPACK2020-2527
DOI: https://doi.org/10.1115/IPACK2020-2527
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Topics: Computational fluid dynamics, Cooling, Friction, Heat sinks, Microchannels, Nanofluids, Nanostructures
Proceedings Papers

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 27–29, 2020
Paper No: IPACK2020-2595
DOI: https://doi.org/10.1115/IPACK2020-2595
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Topics: Computational fluid dynamics, Cooling, Electronics, Fluids, Simulation
Proceedings Papers

CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware

Satyam Saini, Kaustubh K. Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 27–29, 2020
Paper No: IPACK2020-2590
DOI: https://doi.org/10.1115/IPACK2020-2590
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Topics: Computational fluid dynamics, Contamination, Data centers, Hardware, Modeling, Particulate matter
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
DOI: https://doi.org/10.1115/IPACK2020-2591
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Paper No: IPACK2019-6472
DOI: https://doi.org/10.1115/IPACK2019-6472
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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
DOI: https://doi.org/10.1115/IPACK2019-6631
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
DOI: https://doi.org/10.1115/IPACK2019-6391
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

CFD Analysis of Molten Solder Flow Behavior and Bridging Mechanism During Solder Bump Formation

Risa Miyazawa, Keishi Okamoto, Hiroyuki Mori
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 7–9, 2019
Paper No: IPACK2019-6395
DOI: https://doi.org/10.1115/IPACK2019-6395
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Topics: Computational fluid dynamics, Flow (Dynamics), Solders