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Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Paper No: IPACK2022-97437
DOI: https://doi.org/10.1115/IPACK2022-97437
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
DOI: https://doi.org/10.1115/IPACK2020-2695
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
DOI: https://doi.org/10.1115/IPACK2019-6391
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Paper No: IPACK2019-6424
DOI: https://doi.org/10.1115/IPACK2019-6424
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Paper No: IPACK2018-8300
DOI: https://doi.org/10.1115/IPACK2018-8300
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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
DOI: https://doi.org/10.1115/IPACK2018-8436
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
DOI: https://doi.org/10.1115/IPACK2017-74108
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Paper No: IPACK2017-74158
DOI: https://doi.org/10.1115/IPACK2017-74158
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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Paper No: IPACK2015-48523
DOI: https://doi.org/10.1115/IPACK2015-48523
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Paper No: IPACK2015-48714
DOI: https://doi.org/10.1115/IPACK2015-48714
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Paper No: IPACK2015-48326
DOI: https://doi.org/10.1115/IPACK2015-48326
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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Paper No: IPACK2015-48055
DOI: https://doi.org/10.1115/IPACK2015-48055
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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Thermal Evaluation Process on Smart Watches

Angel Qian Han, Nanbo Kang
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A032, July 6–9, 2015
Paper No: IPACK2015-48711
DOI: https://doi.org/10.1115/IPACK2015-48711
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Topics: Battery life, Computer software, Design, Safety, Security, Simulation
Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015
Paper No: IPACK2015-48257
DOI: https://doi.org/10.1115/IPACK2015-48257
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Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Paper No: IPACK2015-48720
DOI: https://doi.org/10.1115/IPACK2015-48720
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Paper No: IPACK2015-48051
DOI: https://doi.org/10.1115/IPACK2015-48051
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Paper No: IPACK2015-48685
DOI: https://doi.org/10.1115/IPACK2015-48685
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods
Proceedings Papers

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Y. S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A053, July 6–9, 2015
Paper No: IPACK2015-48243
DOI: https://doi.org/10.1115/IPACK2015-48243
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Topics: Disks, Heat flux, Interfacial thermal resistance, Electrical conductance, Boundary-value problems, Computer software, Contact resistance, FORTRAN, Modeling, Thermal resistance