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Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022

Paper No: IPACK2022-97669

DOI: https://doi.org/10.1115/IPACK2022-97669

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Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors

Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018

Paper No: IPACK2018-8253

DOI: https://doi.org/10.1115/IPACK2018-8253

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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems

Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018

Paper No: IPACK2018-8322

DOI: https://doi.org/10.1115/IPACK2018-8322

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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine

Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017

Paper No: IPACK2017-74107

DOI: https://doi.org/10.1115/IPACK2017-74107

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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry

Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015

Paper No: IPACK2015-48302

DOI: https://doi.org/10.1115/IPACK2015-48302

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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites

Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015

Paper No: IPACK2015-48593

DOI: https://doi.org/10.1115/IPACK2015-48593

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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety

Proceedings Papers

Do You Know Your Onboard Temperature Sensing IC?

Herman Chu

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 377-384, July 6–8, 2011

Paper No: IPACK2011-52288

DOI: https://doi.org/10.1115/IPACK2011-52288

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Topics: Temperature, Power density, Air flow, Algorithms, Circuit design, Computer simulation, Control systems, Design, Electronic packaging, Heating

Proceedings Papers

A Data-Centric Approach for Integrated Data Center Management

Christopher Hoover

Paper No: IPACK2011-52159

DOI: https://doi.org/10.1115/IPACK2011-52159

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Topics: Data centers, Bridges (Structures), Control systems, Modeling, Visualization

Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh

Paper No: IPACK2011-52265

DOI: https://doi.org/10.1115/IPACK2011-52265

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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems

Proceedings Papers

Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls

Michael K. Patterson, Michael Meakins, Dennis Nasont, Prasad Pusuluri, William Tschudi, Geoffrey C. Bell, Roger Schmidt, Ken Schneebeli, Tom Brey, Monty McGraw, Wade Vinson, Jason Gloeckner

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1015-1020, July 19–23, 2009

Paper No: InterPACK2009-89359

DOI: https://doi.org/10.1115/InterPACK2009-89359

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Topics: Energy efficiency, Technology management, Cooling systems, Data centers, Temperature, Temperature sensors, Air flow, Control systems, Cooling, Design

Proceedings Papers

Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2

Magnus K. Herrlin, Michael K. Patterson

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 875-880, July 19–23, 2009

Paper No: InterPACK2009-89224

DOI: https://doi.org/10.1115/InterPACK2009-89224

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Topics: Cooling, Data centers, Air flow, Density, Design, Heat, Computational fluid dynamics, Cooling systems, Energy efficiency, Control systems

Proceedings Papers

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 945-951, July 19–23, 2009

Paper No: InterPACK2009-89294

DOI: https://doi.org/10.1115/InterPACK2009-89294

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Topics: Cooling systems, Design, Heat, Stress, Control systems, Forced convection, Mineral oil, Natural convection, Power grids, Renewable energy

Proceedings Papers

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Fusaomi Nagata, Shintaro Tani, Takanori Mizobuchi, Tetsuo Hase, Zenku Haga, Keigo Watanabe

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 211-217, July 19–23, 2009

Paper No: InterPACK2009-89042

DOI: https://doi.org/10.1115/InterPACK2009-89042

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Topics: Machine tools, Stick-slip, Finishing, Control systems, Feedback, Feedforward control, Force feedback, Motion control, Lenses (Optics), Mirrors

Proceedings Papers

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007

Paper No: IPACK2007-33456

DOI: https://doi.org/10.1115/IPACK2007-33456

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Topics: Packaging, Reliability, Solders, Temperature, Stress, Ceramics, Control systems, Damage, Failure, Fatigue

Proceedings Papers

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1709-1713, July 17–22, 2005

Paper No: IPACK2005-73145

DOI: https://doi.org/10.1115/IPACK2005-73145

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Topics: Design, Microactuators, Cantilevers, Electrodes, Engineering prototypes, Shapes, Control systems, Deflection, Design methodology, Equilibrium (Physics)

Proceedings Papers

Control of a Laboratory-Based Thermal Management System

Mark H. McKinney, Charles Wall

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 417-421, July 6–11, 2003

Paper No: IPACK2003-35198

DOI: https://doi.org/10.1115/IPACK2003-35198

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Topics: Control systems, Refrigeration, Thermal management, Vapors

Proceedings Papers

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

B. Elliott Short, Jr., Donald C. Price, Peter E. Raad

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 47-55, July 6–11, 2003

Paper No: IPACK2003-35004

DOI: https://doi.org/10.1115/IPACK2003-35004

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Topics: Design, Electronics, Reynolds number, Control systems, Fins, Flow (Dynamics), Friction

Proceedings Papers

Miniature Loop Heat Pipes for Electronic Cooling

Triem T. Hoang, Tamara A. O’Connell, Jentung Ku, C. Dan Butler, Theodore D. Swanson

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 517-525, July 6–11, 2003

Paper No: IPACK2003-35245

DOI: https://doi.org/10.1115/IPACK2003-35245

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Topics: Computer cooling, Heat pipes, Heat, Electronics, Packaging, Water, Control systems, Electricity (Physics), Energy dissipation, Fluids

NARROW

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Weather Analysis Using Neural Networks for Modular Data Centers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Do You Know Your Onboard Temperature Sensing IC?

A Data-Centric Approach for Integrated Data Center Management

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls

Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Reliability of Indium Solder for Cold Temperature Packaging

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Control of a Laboratory-Based Thermal Management System

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

Miniature Loop Heat Pipes for Electronic Cooling

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