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Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Paper No: IPACK2022-98066
https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
https://doi.org/10.1115/IPACK2021-73252
View Paper titled, Transient Performance and Melt Front Characterization of Phase Change Materials
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
https://doi.org/10.1115/IPACK2019-6631
View Paper titled, Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
https://doi.org/10.1115/IPACK2019-6442
View Paper titled, Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
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Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density
Proceedings Papers

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Paper No: IPACK2019-6457
https://doi.org/10.1115/IPACK2019-6457
View Paper titled, Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid
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Topics: Convection, Impingement cooling, Machinery, Temperature, Transmission fluids
Proceedings Papers

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A019, August 27–30, 2018
Paper No: IPACK2018-8394
https://doi.org/10.1115/IPACK2018-8394
View Paper titled, Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool
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Topics: Finite element analysis, Stress analysis (Engineering), Design, Temperature, Stress, Modeling, Thermal stresses, Computation, Convection, Flat heat pipes
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Paper No: IPACK2017-74130
https://doi.org/10.1115/IPACK2017-74130
View Paper titled, Power Packaging Thermal and Stress Model for Quick Parametric Analyses
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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Paper No: IPACK2017-74080
https://doi.org/10.1115/IPACK2017-74080
View Paper titled, State of the Art of Electronics Cooling for Radar Antenna Applications
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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Paper No: IPACK2015-48581
https://doi.org/10.1115/IPACK2015-48581
View Paper titled, Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015
Paper No: IPACK2015-48753
https://doi.org/10.1115/IPACK2015-48753
View Paper titled, Unsteady Heat Flux Measurements in Agitated Channel Flows
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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Paper No: IPACK2015-48685
https://doi.org/10.1115/IPACK2015-48685
View Paper titled, Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods
Proceedings Papers

CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels

Omer Bugra Kanargi, Christopher Yap, Poh Seng Lee
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A083, July 6–9, 2015
Paper No: IPACK2015-48277
https://doi.org/10.1115/IPACK2015-48277
View Paper titled, CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels
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Topics: Computational fluid dynamics, Heat sinks, Flow (Dynamics), Cross connections, Heat transfer, Pressure, Thermal boundary layers, Air flow, Convection, Design
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Paper No: IPACK2015-48370
https://doi.org/10.1115/IPACK2015-48370
View Paper titled, Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Paper No: IPACK2015-48027
https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Paper No: IPACK2015-48033
https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A011, July 6–9, 2015
Paper No: IPACK2015-48417
https://doi.org/10.1115/IPACK2015-48417
View Paper titled, Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
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Topics: Density, Heat exchangers, Flow (Dynamics), Heat, Temperature, Heat sinks, Heat transfer, Hydrofoil, Junctions, Water
Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Paper No: IPACK2013-73053
https://doi.org/10.1115/IPACK2013-73053
View Paper titled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity