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Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Paper No: IPACK2022-94505
DOI: https://doi.org/10.1115/IPACK2022-94505
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Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints
Proceedings Papers

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Paper No: IPACK2018-8315
DOI: https://doi.org/10.1115/IPACK2018-8315
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Topics: Atoms, Crystals, Molecular dynamics simulation, Surface roughness, Temperature
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
DOI: https://doi.org/10.1115/IPACK2017-74133
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Paper No: IPACK2017-74181
DOI: https://doi.org/10.1115/IPACK2017-74181
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Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap

Mahmoud Elzouka, Sidy Ndao
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 29–September 1, 2017
Paper No: IPACK2017-74212
DOI: https://doi.org/10.1115/IPACK2017-74212
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Topics: Crystals, Thermal radiation, Heat transfer, Heat, Flow (Dynamics), Radiative heat transfer, Vacuum, Electronics, Engineering prototypes, Numerical analysis
Proceedings Papers

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Paper No: IPACK2015-48032
DOI: https://doi.org/10.1115/IPACK2015-48032
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Topics: Thermal conductivity, Alloys, Crystals, Gallium nitride, Mean free path, Size effect, Temperature
Proceedings Papers

Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal

Subhasis Mukherjee, Bite Zhou, Abhijit Dasgupta, Thomas R. Bieler
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A006, July 6–9, 2015
Paper No: IPACK2015-48710
DOI: https://doi.org/10.1115/IPACK2015-48710
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Topics: Anisotropy, Creep, Crystals, Modeling, Steady state, Tin, Dislocations, Stress, Dislocation density, Nanoscale phenomena
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Paper No: IPACK2015-48623
DOI: https://doi.org/10.1115/IPACK2015-48623
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Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Paper No: IPACK2013-73324
DOI: https://doi.org/10.1115/IPACK2013-73324
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Paper No: IPACK2013-73315
DOI: https://doi.org/10.1115/IPACK2013-73315
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

Takahiro Akutsu, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 691-700, July 6–8, 2011
Paper No: IPACK2011-52070
DOI: https://doi.org/10.1115/IPACK2011-52070
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Topics: Fatigue, Lead-free solders, Fatigue cracks, Crystals, Finite element methods, Finite element model, Solder joints, Fatigue life, Grain size, Solders
Proceedings Papers

Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 325-328, July 6–8, 2011
Paper No: IPACK2011-52241
DOI: https://doi.org/10.1115/IPACK2011-52241
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Topics: Silicon, Silicon chips, Thermal stresses, Stress, Copper, Crystals, Damage, Reliability, Yield stress, Cycles
Proceedings Papers

Numerical Solutions of Poisson Equation by the CIP-Basis Set Method

Daisuke Shibata, Takayuki Utsumi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 91-98, July 19–23, 2009
Paper No: InterPACK2009-89150
DOI: https://doi.org/10.1115/InterPACK2009-89150
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Topics: Poisson equation, Waves, Polynomials, Computers, Crystals, Density, Eigenvalues, Electron configuration, Electrons, Errors
Proceedings Papers

Numerical Calculation for Phonon Properties of a Nano-Porous Si

Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 557-561, July 19–23, 2009
Paper No: InterPACK2009-89118
DOI: https://doi.org/10.1115/InterPACK2009-89118
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Topics: Phonons, Fourier transforms, Thermal conductivity, Boundary-value problems, Crystals, Density, Heat conduction, Mean free path, Molecular dynamics simulation, Nanostructures
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Paper No: IPACK2007-33880
DOI: https://doi.org/10.1115/IPACK2007-33880
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Proceedings Papers

Effect of Underfilling Materials and Processes on the Reliability of System in Package

Tae Hyun Kim, Sung Yi, Jae Ky Roh, Chang Mu Jung, Yan Shuang Guo, Jae Chun Do, Jin Gu Kim, Shan Guo, Jupyo Hong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1-8, July 8–12, 2007
Paper No: IPACK2007-33034
DOI: https://doi.org/10.1115/IPACK2007-33034
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Topics: Reliability, System-in-package, Manufacturing, Solders, Adhesion, Computer simulation, Crystals, Delamination, Dimensions, Failure mechanisms
Proceedings Papers

Molecular Dynamic Simulation of Crack Propagation Behavior in Nano Size HCP Crystals

Shinji Ando, Leping Bu, Masayuki Tsushida, Hideki Tonda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1685-1688, July 17–22, 2005
Paper No: IPACK2005-73042
DOI: https://doi.org/10.1115/IPACK2005-73042
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Topics: Crack propagation, Crystals, Molecular dynamics, Simulation, Fracture (Materials), Microelectromechanical systems, Molecular dynamics methods, Shear (Mechanics), Stress, Stress-strain curves
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Paper No: IPACK2005-73134
DOI: https://doi.org/10.1115/IPACK2005-73134
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Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods
Proceedings Papers

Thermal Radiative Properties of Photonic Crystals

Koji Miyazaki, Masahiro Kihara, Hiroshi Tsukamoto
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1347-1350, July 17–22, 2005
Paper No: IPACK2005-73135
DOI: https://doi.org/10.1115/IPACK2005-73135
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Topics: Crystals, Reflectance, Particulate matter, Catalysts, Fourier transform infrared spectroscopy, Heat transfer, Self-assembly, Semiconductor wafers, Snell's law, Thermal radiation
Proceedings Papers

Calibration Systems and Techniques for Automated Microassembly

K. Tsui, A. Geisberger, M. Ellis, G. Skidmore
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 251-255, July 6–11, 2003
Paper No: IPACK2003-35208
DOI: https://doi.org/10.1115/IPACK2003-35208
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Topics: Calibration, Microassembling, Manufacturing, Crystals, End effectors, Geometry, Microelectromechanical systems, Nickel, Robotics, Silicon