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Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022

Paper No: IPACK2022-93878

DOI: https://doi.org/10.1115/IPACK2022-93878

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Topics: Creep, Damage, Lead-free solders, Solders

Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021

Paper No: IPACK2021-73100

DOI: https://doi.org/10.1115/IPACK2021-73100

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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders

Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021

Paper No: IPACK2021-68902

DOI: https://doi.org/10.1115/IPACK2021-68902

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Topics: Damage, Electrodiffusion, Flexible electronics, Stress

Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021

Paper No: IPACK2021-74062

DOI: https://doi.org/10.1115/IPACK2021-74062

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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components

Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020

Paper No: IPACK2020-2648

DOI: https://doi.org/10.1115/IPACK2020-2648

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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics

Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020

Paper No: IPACK2020-2676

DOI: https://doi.org/10.1115/IPACK2020-2676

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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)

Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020

Paper No: IPACK2020-2677

DOI: https://doi.org/10.1115/IPACK2020-2677

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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 7–9, 2019

Paper No: IPACK2019-6423

DOI: https://doi.org/10.1115/IPACK2019-6423

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Topics: Motors, Permanent magnets, Stators, Electric propulsion, Emissions, Maintenance, Winding (process), Damage, Flaw detection, Mechanical admittance

Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019

Paper No: IPACK2019-6507

DOI: https://doi.org/10.1115/IPACK2019-6507

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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018

Paper No: IPACK2018-8275

DOI: https://doi.org/10.1115/IPACK2018-8275

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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip

Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018

Paper No: IPACK2018-8414

DOI: https://doi.org/10.1115/IPACK2018-8414

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Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders

Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018

Paper No: IPACK2018-8257

DOI: https://doi.org/10.1115/IPACK2018-8257

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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics

Proceedings Papers

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 27–30, 2018

Paper No: IPACK2018-8356

DOI: https://doi.org/10.1115/IPACK2018-8356

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Topics: Damage assessment, Electronics, Temperature, Vibration, Damage, Failure, Signals, Safety, High temperature, Principal component analysis

Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018

Paper No: IPACK2018-8358

DOI: https://doi.org/10.1115/IPACK2018-8358

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Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum

Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017

Paper No: IPACK2017-74233

DOI: https://doi.org/10.1115/IPACK2017-74233

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Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry

Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman

Paper No: IPACK2017-74249

DOI: https://doi.org/10.1115/IPACK2017-74249

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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature

Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017

Paper No: IPACK2017-74059

DOI: https://doi.org/10.1115/IPACK2017-74059

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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons

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NARROW

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

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