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Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022

Paper No: IPACK2022-97457

DOI: https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015

Paper No: IPACK2015-48563

DOI: https://doi.org/10.1115/IPACK2015-48563

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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling

Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015

Paper No: IPACK2015-48639

DOI: https://doi.org/10.1115/IPACK2015-48639

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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation

Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura

Paper No: IPACK2015-48197

DOI: https://doi.org/10.1115/IPACK2015-48197

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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)

Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

Paper No: IPACK2015-48200

DOI: https://doi.org/10.1115/IPACK2015-48200

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Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams

Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013

Paper No: IPACK2013-73053

DOI: https://doi.org/10.1115/IPACK2013-73053

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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity

Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura

Paper No: IPACK2013-73149

DOI: https://doi.org/10.1115/IPACK2013-73149

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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries

Proceedings Papers

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

Paper No: IPACK2013-73148

DOI: https://doi.org/10.1115/IPACK2013-73148

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Topics: Copper, Thin films, Electroplating, Electrical properties, Electrical resistivity, Annealing, Bulk solids, Density, Grain boundaries, High temperature

Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011

Paper No: IPACK2011-52058

DOI: https://doi.org/10.1115/IPACK2011-52058

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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)

Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen

Paper No: IPACK2011-52079

DOI: https://doi.org/10.1115/IPACK2011-52079

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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity

Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno

Paper No: IPACK2011-52019

DOI: https://doi.org/10.1115/IPACK2011-52019

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Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity

Proceedings Papers

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52057

DOI: https://doi.org/10.1115/IPACK2011-52057

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Topics: Carbon nanotubes, Electrical conductivity, Graphene, Thermal conductivity, Buckling, Cylinders, Deformation, Shapes, Density functional theory, Electrical resistivity

Proceedings Papers

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 317-320.8, July 19–23, 2009

Paper No: InterPACK2009-89328

DOI: https://doi.org/10.1115/InterPACK2009-89328

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Topics: Quantum wells, Testing performance, Electrical resistivity, Thin films, Stress, Temperature, Alloys, Bulk solids, Copper, Electrical properties

Proceedings Papers

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 477-484, July 19–23, 2009

Paper No: InterPACK2009-89246

DOI: https://doi.org/10.1115/InterPACK2009-89246

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Topics: Actuators, Displacement, Electrical resistivity, Microelectromechanical systems, Silicon, Temperature, Dimensions, Electrical resistance, Feedback, Heat conduction

Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007

Paper No: IPACK2007-33053

DOI: https://doi.org/10.1115/IPACK2007-33053

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Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation

Proceedings Papers

Modeling Thermoelectric Device Enhancement of Heat Sink Performance

Richard I. Roser, Robert M. Smythe, Malkiat Singh

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 235-240, July 8–12, 2007

Paper No: IPACK2007-33688

DOI: https://doi.org/10.1115/IPACK2007-33688

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Topics: Heat sinks, Modeling, Thermoelectric devices, Temperature, Heat, Cooling, Design, Thermal resistance, Air flow, Dimensions

Proceedings Papers

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 297-307, July 8–12, 2007

Paper No: IPACK2007-33570

DOI: https://doi.org/10.1115/IPACK2007-33570

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Topics: Calibration, Hydrostatics, Silicon, Stress, Sensors, Temperature, Pressure, Electrical resistivity, Experimental methods, Manufacturing

Proceedings Papers

Characterization of 1 st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

Arun Madyala, Adam Huang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 509-513, July 8–12, 2007

Paper No: IPACK2007-33871

DOI: https://doi.org/10.1115/IPACK2007-33871

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Topics: Aircraft, Elastomers, Microelectromechanical systems, Sensors, Manufacturing, Carbon black pigments, Design, Electrical resistivity, Mechanical properties, Metals

NARROW

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Thermal Performance Enhancement of Glass Interposer

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Modeling Thermoelectric Device Enhancement of Heat Sink Performance

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Characterization of 1 st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

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