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Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Paper No: IPACK2022-97412
DOI: https://doi.org/10.1115/IPACK2022-97412
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Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Paper No: IPACK2017-74107
DOI: https://doi.org/10.1115/IPACK2017-74107
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

Yichao Yang, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Paper No: IPACK2015-48133
DOI: https://doi.org/10.1115/IPACK2015-48133
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Topics: Microfluidics, Tactile sensors, Torque, Transducers, Microchannels, Electrolytes, Computer numerical control machine tools, Electrodes, Engineering prototypes, Lithography
Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A002, July 6–9, 2015
Paper No: IPACK2015-48491
DOI: https://doi.org/10.1115/IPACK2015-48491
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Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Paper No: IPACK2013-73158
DOI: https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Paper No: IPACK2013-73130
DOI: https://doi.org/10.1115/IPACK2013-73130
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A011, July 16–18, 2013
Paper No: IPACK2013-73171
DOI: https://doi.org/10.1115/IPACK2013-73171
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Topics: Electrodes, Lead-free solders, Tin, Plating baths, Shear (Mechanics), Solders, Intermetallic compounds, Melting, Nickel plating
Proceedings Papers

A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

Stephen H. Taylor, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A051, July 16–18, 2013
Paper No: IPACK2013-73283
DOI: https://doi.org/10.1115/IPACK2013-73283
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Topics: Capacitance, Electrodes, Junctions, Electric fields, Design, Sensors, Circuits, Dimensions, Fracture (Materials), Network models
Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011
Paper No: IPACK2011-52025
DOI: https://doi.org/10.1115/IPACK2011-52025
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Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties
Proceedings Papers

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 663-666, July 6–8, 2011
Paper No: IPACK2011-52024
DOI: https://doi.org/10.1115/IPACK2011-52024
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Topics: Electrodes, Lead-free solders, Plating, Shear strength, Shear (Mechanics), Tin, Reliability, Solders
Proceedings Papers

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Paper No: IPACK2011-52071
DOI: https://doi.org/10.1115/IPACK2011-52071
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Topics: Heat, Joules, Metals, Thermoelectricity, Welding, Wire, Temperature, Circuits, Electrodes
Proceedings Papers

Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

Han-Jung Wang, Hung-An Deng, Shih-Ying Chiang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 401-407, July 6–8, 2011
Paper No: IPACK2011-52201
DOI: https://doi.org/10.1115/IPACK2011-52201
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Topics: Microelectromechanical systems, Microphones, Modeling, Stress, Thin films, Finite element analysis, Aluminum, Deformation, Polysilicon, Residual stresses
Proceedings Papers

Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

Hiroki Yanamori, Takuma Kobayashi, Masaki Omiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 417-424, July 6–8, 2011
Paper No: IPACK2011-52259
DOI: https://doi.org/10.1115/IPACK2011-52259
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Topics: Actuators, Metallic composites, Microelectromechanical systems, Polymers, Sensors, Electrodes, Electric fields, Membranes, Temperature, Composite materials
Proceedings Papers

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1-8, July 19–23, 2009
Paper No: InterPACK2009-89019
DOI: https://doi.org/10.1115/InterPACK2009-89019
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Topics: Process simulation, Shapes, Solder joints, Reliability, Electronic components, Manufacturing, Simulation, Surface tension, Crack propagation, Design
Proceedings Papers

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 517-520, July 19–23, 2009
Paper No: InterPACK2009-89058
DOI: https://doi.org/10.1115/InterPACK2009-89058
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Topics: Chain, Electric fields, Electrodes, Film thickness, Glass, Irradiation (Radiation exposure), Microscopy, Polymer films, Resonance, Silicon
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Paper No: InterPACK2009-89145
DOI: https://doi.org/10.1115/InterPACK2009-89145
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams
Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009
Paper No: InterPACK2009-89099
DOI: https://doi.org/10.1115/InterPACK2009-89099
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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics
Proceedings Papers

Manipulation of Thin Metallic Wires by Joule Heat Joining

Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009
Paper No: InterPACK2009-89122
DOI: https://doi.org/10.1115/InterPACK2009-89122
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Topics: Heat, Joining, Joules, Wire, Electrical properties, Electrodes, Electromagnetic actuators, Heating, Microelectromechanical systems, Nanoelectromechanical systems
Proceedings Papers

Novel Miniature DMFC With Monolithic Si Electrodes

Masanori Hayase, Yosuke Saito
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 459-462, July 19–23, 2009
Paper No: InterPACK2009-89143
DOI: https://doi.org/10.1115/InterPACK2009-89143
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Topics: Direct methanol fuel cells, Electrodes, Catalysts, Plating, Semiconductor wafers, Energy generation, Engineering prototypes, Fuels, Metals, Methanol
Proceedings Papers

High-Density Room-Temperature 3D Chip-Stacking Using Mechanical Caulking With Compliant Bump and Through-Hole-Electrode

Naoya Watanabe, Michihiro Kawashita, Yasuhiro Yoshimura, Naotaka Tanaka, Tanemasa Asano
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 33-38, July 19–23, 2009
Paper No: InterPACK2009-89274
DOI: https://doi.org/10.1115/InterPACK2009-89274
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Topics: Density, Electrodes, Temperature, Electroplating, Pattern formation