1-20 of 37
Electronic systems
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

AI-Based Reliability Assessment of Power Electronic Systems

F. Patrick McCluskey, Clifton Buxbaum, Sudip K. Mazumder, Arif Sarwat, Matt Ursino, Miles C. Russell
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A015, October 25–27, 2022
Paper No: IPACK2022-97614
DOI: https://doi.org/10.1115/IPACK2022-97614
View Paper
PDF
Topics: Digital twin, Electronic systems, Reliability
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Paper No: IPACK2020-2581
DOI: https://doi.org/10.1115/IPACK2020-2581
View Paper
PDF
Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

A Review of Degradation Behavior and Modeling of Capacitors

Anunay Gupta, Om Prakash Yadav, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Paper No: IPACK2018-8262
DOI: https://doi.org/10.1115/IPACK2018-8262
View Paper
PDF
Topics: Capacitors, Modeling, Failure, Electronic systems, Metallized plastic film, Physics, Reliability
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Paper No: IPACK2018-8392
DOI: https://doi.org/10.1115/IPACK2018-8392
View Paper
PDF
Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
View Paper
PDF
Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Paper No: IPACK2018-8355
DOI: https://doi.org/10.1115/IPACK2018-8355
View Paper
PDF
Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Paper No: IPACK2018-8386
DOI: https://doi.org/10.1115/IPACK2018-8386
View Paper
PDF
Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Paper No: IPACK2017-74138
DOI: https://doi.org/10.1115/IPACK2017-74138
View Paper
PDF
Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Paper No: IPACK2017-74058
DOI: https://doi.org/10.1115/IPACK2017-74058
View Paper
PDF
Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
View Paper
PDF
Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017
Paper No: IPACK2017-74232
DOI: https://doi.org/10.1115/IPACK2017-74232
View Paper
PDF
Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Paper No: IPACK2015-48757
DOI: https://doi.org/10.1115/IPACK2015-48757
View Paper
PDF
Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
View Paper
PDF
Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Paper No: IPACK2015-48274
DOI: https://doi.org/10.1115/IPACK2015-48274
View Paper
PDF
Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Paper No: IPACK2013-73245
DOI: https://doi.org/10.1115/IPACK2013-73245
View Paper
PDF
Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013
Paper No: IPACK2013-73309
DOI: https://doi.org/10.1115/IPACK2013-73309
View Paper
PDF
Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Paper No: IPACK2013-73251
DOI: https://doi.org/10.1115/IPACK2013-73251
View Paper
PDF
Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability
Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011
Paper No: IPACK2011-52179
DOI: https://doi.org/10.1115/IPACK2011-52179
View Paper
PDF
Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products
Proceedings Papers

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 741-747, July 6–8, 2011
Paper No: IPACK2011-52191
DOI: https://doi.org/10.1115/IPACK2011-52191
View Paper
PDF
Topics: Electronics, Entropy, Exergy analysis, Heat recovery, Heat, Electronic systems, Brayton cycle, Design, Energy / power systems, Energy conversion
Proceedings Papers

KL Transform and Neural-Net Based Framework for Failure Modes Classification in Electronics Subjected to Mechanical-Shock

Pradeep Lall, Prashant Gupta, Kai Goebel
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 563-578, July 6–8, 2011
Paper No: IPACK2011-52198
DOI: https://doi.org/10.1115/IPACK2011-52198
View Paper
PDF
Topics: Artificial neural networks, Electronics, Failure mechanisms, Shock (Mechanics), Failure, Parity (Physics), Damage, Vibration, Algorithms, Copper