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Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022
Paper No: IPACK2022-97669
DOI: https://doi.org/10.1115/IPACK2022-97669
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Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Paper No: IPACK2017-74208
DOI: https://doi.org/10.1115/IPACK2017-74208
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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

A Statistical Approach to Real-Time Updating and Automatic Scheduling of Physical Models

Huijing Jiang, Xinwei Deng, Vanessa Lopez, Hendrik Hamann
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A005, July 16–18, 2013
Paper No: IPACK2013-73042
DOI: https://doi.org/10.1115/IPACK2013-73042
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Topics: Air pollution, Computational fluid dynamics, Data centers, Economics , Energy consumption, Energy management, Modeling, Physics, Resolution (Optics), Sensors
Proceedings Papers

Modelling Reliability of Power Electronics Packaging

Chris Bailey, Hua Lu, Chunyan Yin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 215-220, July 19–23, 2009
Paper No: InterPACK2009-89430
DOI: https://doi.org/10.1115/InterPACK2009-89430
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Topics: Electronic packaging, Modeling, Reliability, Electronics, Semiconductors (Materials), Aluminum, Design, Electric vehicles, Electricity (Physics), Energy management
Proceedings Papers

A Real-Time Data Center Airflow and Energy Assessment Tool

Xuanhang Simon Zhang, James W. VanGilder, Christopher M. Healey
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 793-798, July 19–23, 2009
Paper No: InterPACK2009-89175
DOI: https://doi.org/10.1115/InterPACK2009-89175
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Topics: Air flow, Data centers, Energy assessment, Temperature, Stress, Computer software, Cooling, Energy consumption, Energy management, Plant layout