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Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Paper No: IPACK2018-8468
DOI: https://doi.org/10.1115/IPACK2018-8468
View Paper titled, Practical Concerns for Adoption of Microjet Cooling
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Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Paper No: IPACK2015-48689
DOI: https://doi.org/10.1115/IPACK2015-48689
View Paper titled, Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Paper No: IPACK2015-48757
DOI: https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Paper No: IPACK2015-48334
DOI: https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel

Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A010, July 16–18, 2013
Paper No: IPACK2013-73170
DOI: https://doi.org/10.1115/IPACK2013-73170
View Paper titled, Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel
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Topics: Plasmas (Ionized gases), Stainless steel, Tin, Erosion, Diffusion (Physics), Temperature
Proceedings Papers

Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 673-676, July 6–8, 2011
Paper No: IPACK2011-52026
DOI: https://doi.org/10.1115/IPACK2011-52026
View Paper titled, Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder
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Topics: Erosion, Lead-free solders, Nitriding, Plasmas (Ionized gases), Stainless steel, Tin, Diffusion (Physics), Solders, Steel
Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
DOI: https://doi.org/10.1115/IPACK2005-73407
View Paper titled, Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics
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Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management