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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022

Paper No: IPACK2022-97455

DOI: https://doi.org/10.1115/IPACK2022-97455

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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices

Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019

Paper No: IPACK2019-6389

DOI: https://doi.org/10.1115/IPACK2019-6389

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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness

Proceedings Papers

Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

Satoru Mizuno, Tamio Ida, Manabu Fuchihata, Edmundo Sanchez, Jr., Koji Yoshikuni

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A004, July 6–9, 2015

Paper No: IPACK2015-48767

DOI: https://doi.org/10.1115/IPACK2015-48767

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Topics: Biomass, Coke, Compressive strength, Density, Compression, High temperature, Temperature, Water, Coal, Fibers

Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015

Paper No: IPACK2015-48019

DOI: https://doi.org/10.1115/IPACK2015-48019

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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis

Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013

Paper No: IPACK2013-73290

DOI: https://doi.org/10.1115/IPACK2013-73290

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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves

Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011

Paper No: IPACK2011-52218

DOI: https://doi.org/10.1115/IPACK2011-52218

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Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance

Proceedings Papers

An Innovative Way to Measure Temperature by Using the Faraday Effect

Pranav Limaye, Anisur Rehman

Paper No: IPACK2011-52202

DOI: https://doi.org/10.1115/IPACK2011-52202

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Topics: Faraday effect, Temperature, Magnetic fields, Cables, Electromagnetic interference, Fibers, Insulation, Magnets, Optical fiber, Permanent magnets

Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

David A. Miller

Paper No: IPACK2011-52293

DOI: https://doi.org/10.1115/IPACK2011-52293

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)

Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Yuji Nishimura, Qiang Yu

Paper No: IPACK2011-52105

DOI: https://doi.org/10.1115/IPACK2011-52105

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Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing

Proceedings Papers

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

Lang Yuan, Jignesh Patel

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009

Paper No: InterPACK2009-89377

DOI: https://doi.org/10.1115/InterPACK2009-89377

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Topics: Acoustics, Air filters, Design, Fibers, Noise (Sound), Telecommunications, Thermal management

Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009

Paper No: InterPACK2009-89340

DOI: https://doi.org/10.1115/InterPACK2009-89340

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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning

Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009

Paper No: InterPACK2009-89233

DOI: https://doi.org/10.1115/InterPACK2009-89233

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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design

Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009

Paper No: InterPACK2009-89034

DOI: https://doi.org/10.1115/InterPACK2009-89034

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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers

Proceedings Papers

Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Okawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 219-227, July 19–23, 2009

Paper No: InterPACK2009-89060

DOI: https://doi.org/10.1115/InterPACK2009-89060

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Topics: Drilling, Drills (Tools), Optimization, Printed circuit boards, Temperature, Fibers, Glass reinforced plastics

Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009

Paper No: InterPACK2009-89221

DOI: https://doi.org/10.1115/InterPACK2009-89221

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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology

Proceedings Papers

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

Paul J. Huspeni, Ly Le, Wei Liu, Elli Saravanos, Shannon Adkins

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 673-683, July 19–23, 2009

Paper No: InterPACK2009-89217

DOI: https://doi.org/10.1115/InterPACK2009-89217

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Topics: Optical fiber, Stress, Fibers, Manufacturing, Maximum likelihood estimation, Failure, Reliability, Statistical analysis, Coating processes, Coatings

Proceedings Papers

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005

Paper No: IPACK2005-73278

DOI: https://doi.org/10.1115/IPACK2005-73278

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Topics: Composite materials, Cooling, Fibers, Heat pipes

Proceedings Papers

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, L. Nguyen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1471-1478, July 17–22, 2005

Paper No: IPACK2005-73258

DOI: https://doi.org/10.1115/IPACK2005-73258

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Topics: Materials characterization, Resolution (Optics), Composite materials, Computer software, Displacement, B-splines, Fibers, High temperature, Mechanical testing, Packaging

Proceedings Papers

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 907-920, July 17–22, 2005

Paper No: IPACK2005-73249

DOI: https://doi.org/10.1115/IPACK2005-73249

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Topics: Photonic systems, Structural analysis, Modeling, Design, ASME honors and awards, Engineering disciplines, Engineering research, Experimental methods, Fibers, Finite element analysis

Proceedings Papers

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

Parsaoran Hutapea, Joachim L. Grenestedt, Mitul Modi, Michael Mello, Kristopher Frutschy

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1141-1145, July 17–22, 2005

Paper No: IPACK2005-73122

DOI: https://doi.org/10.1115/IPACK2005-73122

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Topics: Finite element model, Thermomechanics, Warping, Adhesion, Copper, Curve fitting, Density, Fibers, Finite element analysis, Polymers

NARROW

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

Hot Spot Elimination by Thin and Smart Heat Spreader

Micro Cryogenic Coolers With Mixed Refrigerants

High Performance Thermal Conductive Sheets Made of Carbon Fibers

An Innovative Way to Measure Temperature by Using the Faraday Effect

Characterization of a Macrofiber Piezoelectric Composite

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

Structural Analysis of Microelectronic and Photonic Systems

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

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