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Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022

Paper No: IPACK2022-98066

DOI: https://doi.org/10.1115/IPACK2022-98066

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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration

Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017

Paper No: IPACK2017-74239

DOI: https://doi.org/10.1115/IPACK2017-74239

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Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration

Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015

Paper No: IPACK2015-48049

DOI: https://doi.org/10.1115/IPACK2015-48049

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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits

Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013

Paper No: IPACK2013-73222

DOI: https://doi.org/10.1115/IPACK2013-73222

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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure

Proceedings Papers

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011

Paper No: IPACK2011-52210

DOI: https://doi.org/10.1115/IPACK2011-52210

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Topics: Data centers, Evaporative cooling, Cooling, Temperature, Climate, Computers, Energy consumption, Air conditioning, Evaporation, Filtration

Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009

Paper No: InterPACK2009-89340

DOI: https://doi.org/10.1115/InterPACK2009-89340

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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning

Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005

Paper No: IPACK2005-73127

DOI: https://doi.org/10.1115/IPACK2005-73127

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Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature

NARROW

Topology Optimization of Heat Sink for 3d Integrated Power Converters

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Topology Optimization of Heat Sink for 3d Integrated Power Converters

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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