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Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022

Paper No: IPACK2022-97402

DOI: https://doi.org/10.1115/IPACK2022-97402

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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity

Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021

Paper No: IPACK2021-72975

DOI: https://doi.org/10.1115/IPACK2021-72975

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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis

Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020

Paper No: IPACK2020-2569

DOI: https://doi.org/10.1115/IPACK2020-2569

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Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer

Proceedings Papers

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015

Paper No: IPACK2015-48671

DOI: https://doi.org/10.1115/IPACK2015-48671

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Topics: Cooling, Heat pipes, Heat sinks, Manufacturing, Air flow, Forced convection, Heat, Heat losses, Telecommunications, Thermal management

Proceedings Papers

A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel

Yan Fan, Poh Seng Lee, Li-Wen Jin, Beng Wah Chua, Na-Si Mou, Mrinal Jagirdar

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A033, July 16–18, 2013

Paper No: IPACK2013-73162

DOI: https://doi.org/10.1115/IPACK2013-73162

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Topics: Computational fluid dynamics, Dimensions, Engineering simulation, Flow (Dynamics), Forced convection, Heat, Heat flux, Heat sinks, Heat transfer, Laminar flow

Proceedings Papers

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

John Edward Fernandes, Saeed Ghalambor, Richard Eiland, Dereje Agonafer, Veerendra Mulay

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A025, July 16–18, 2013

Paper No: IPACK2013-73107

DOI: https://doi.org/10.1115/IPACK2013-73107

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Topics: Energy consumption, Forced convection, Fans, Heat sinks, Temperature, Cooling, Manufacturing, Data centers, Heat, Junctions

Proceedings Papers

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Saeed Ghalambor, John Edward Fernandes, Dereje Agonafer, Veerendra Mulay

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A026, July 16–18, 2013

Paper No: IPACK2013-73108

DOI: https://doi.org/10.1115/IPACK2013-73108

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Topics: Forced convection, Heat sinks, Manufacturing, Pressure, Design, Screws, Computer simulation, Cooling, Microelectronic devices, Numerical analysis

Proceedings Papers

Development of a Hybrid PCM-Air Heat Sink

Y. Kozak, B. Abramzon, G. Ziskind

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 173-178, July 6–8, 2011

Paper No: IPACK2011-52097

DOI: https://doi.org/10.1115/IPACK2011-52097

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Topics: Heat sinks, Temperature, Heat, Melting, Energy dissipation, Phase change materials, Thermal management, Aluminum, Cooling, Delays

Proceedings Papers

Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks

Madhusudan Iyengar, Avram Bar-Cohen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 319-326, July 19–23, 2009

Paper No: InterPACK2009-89093

DOI: https://doi.org/10.1115/InterPACK2009-89093

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Topics: Design for Manufacturing, Heat sinks, Aluminum, Cooling, Copper, Magnesium (Metal), Manufacturing, Computers, Cycles, Design

Proceedings Papers

Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve

Hajime Nakamura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 221-228, July 19–23, 2009

Paper No: InterPACK2009-89010

DOI: https://doi.org/10.1115/InterPACK2009-89010

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Topics: Cooling, Design, Electronic equipment, Modeling, Flow (Dynamics), Computational fluid dynamics, Fans, Pressure, Simulation, Forced convection

Proceedings Papers

A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 693-699, July 19–23, 2009

Paper No: InterPACK2009-89071

DOI: https://doi.org/10.1115/InterPACK2009-89071

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Topics: Transients (Dynamics), Inductors, Cooling, Forced convection, Operating temperature, Steady state, Temperature, Waste heat

Proceedings Papers

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 945-951, July 19–23, 2009

Paper No: InterPACK2009-89294

DOI: https://doi.org/10.1115/InterPACK2009-89294

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Topics: Cooling systems, Design, Heat, Stress, Control systems, Forced convection, Mineral oil, Natural convection, Power grids, Renewable energy

Proceedings Papers

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 187-191, July 19–23, 2009

Paper No: InterPACK2009-89415

DOI: https://doi.org/10.1115/InterPACK2009-89415

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Topics: Heat transfer, Thermal stresses, Fluids, Design, Heat, Temperature, Temperature profiles, Wall temperature, Boundary-value problems, Degrees of freedom

Proceedings Papers

Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins

Bassam A. K. Abu-Hijleh

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 565-570, July 8–12, 2007

Paper No: IPACK2007-33553

DOI: https://doi.org/10.1115/IPACK2007-33553

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Topics: Cross-flow, Cylinders, Fins, Forced convection, Heat transfer, Diluents, Reynolds number

Proceedings Papers

Fluid Flow and Heat Transfer Over a Micro-Sphere

M. A. Antar

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 819-824, July 8–12, 2007

Paper No: IPACK2007-33765

DOI: https://doi.org/10.1115/IPACK2007-33765

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Topics: Fluid dynamics, Heat transfer, Flow (Dynamics), Knudsen number, Cooling, Microscale devices, Reynolds number, Boundary-value problems, Electromechanical devices, Electromechanical systems

Proceedings Papers

Closed Loop Liquid Cooling for High Performance Computer Systems

Sukhvinder Kang, David Miller, John Cennamo

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 509-515, July 8–12, 2007

Paper No: IPACK2007-33870

DOI: https://doi.org/10.1115/IPACK2007-33870

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Topics: Computers, Cooling, Heat, Cooling systems, Copper, Fluids, Graphics processing units, Stress, Temperature, Coolants

Proceedings Papers

Zoom-In Modeling of Packages in Forced Convection Electronics Cooling Incorporating a Superposition Approach

Sriram Neelakantan, Bennett Joiner, Richard L. Scott

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 429-435, July 8–12, 2007

Paper No: IPACK2007-33280

DOI: https://doi.org/10.1115/IPACK2007-33280

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Topics: Boundary-value problems, Computational fluid dynamics, Computer cooling, Design, Electronics, Flow (Dynamics), Forced convection, Heat, Heat sinks, Heat transfer

Proceedings Papers

Forced-Convection Boiling Characteristics Based on Mass and Energy Conservation

Keisuke Horiuchi, Shigeo Ohashi

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 329-334, July 8–12, 2007

Paper No: IPACK2007-33471

DOI: https://doi.org/10.1115/IPACK2007-33471

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Topics: Boiling, Energy conservation, Forced convection

Proceedings Papers

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Waqar A. Khan, Michael M. Yovanovich

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 199-209, July 8–12, 2007

Paper No: IPACK2007-33636

DOI: https://doi.org/10.1115/IPACK2007-33636

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Topics: Fluid dynamics, Heat sinks, Heat transfer, Modeling, Momentum, Viscosity, Boundary-value problems, Flow (Dynamics), Fluids, Forced convection

Proceedings Papers

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

Frank Fan Wang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 211-216, July 8–12, 2007

Paper No: IPACK2007-33070

DOI: https://doi.org/10.1115/IPACK2007-33070

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Topics: Cooling, Ducts, Electronic equipment, Design, Aerospace industry, Air flow, Buoyancy, Computational fluid dynamics, Electronics, Failure

NARROW

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Development of a Hybrid PCM-Air Heat Sink

Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks

Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve

A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Laminar Cross-Flow Conjugated Forced Convection Heat Transfer From a Cylinder With Fins

Fluid Flow and Heat Transfer Over a Micro-Sphere

Closed Loop Liquid Cooling for High Performance Computer Systems

Zoom-In Modeling of Packages in Forced Convection Electronics Cooling Incorporating a Superposition Approach

Forced-Convection Boiling Characteristics Based on Mass and Energy Conservation

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

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