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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022

Paper No: IPACK2022-97434

DOI: https://doi.org/10.1115/IPACK2022-97434

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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control

Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022

Paper No: IPACK2022-97416

DOI: https://doi.org/10.1115/IPACK2022-97416

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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks

Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022

Paper No: IPACK2022-97587

DOI: https://doi.org/10.1115/IPACK2022-97587

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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat

Proceedings Papers

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021

Paper No: IPACK2021-74108

DOI: https://doi.org/10.1115/IPACK2021-74108

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Topics: Additive manufacturing, Cooling, Graphics processing units, Nitrogen, Plates (structures)

Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021

Paper No: IPACK2021-69723

DOI: https://doi.org/10.1115/IPACK2021-69723

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Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks

Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020

Paper No: IPACK2020-2670

DOI: https://doi.org/10.1115/IPACK2020-2670

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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density

Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019

Paper No: IPACK2019-6444

DOI: https://doi.org/10.1115/IPACK2019-6444

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Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers

Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A009, July 6–9, 2015

Paper No: IPACK2015-48811

DOI: https://doi.org/10.1115/IPACK2015-48811

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Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling

Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011

Paper No: IPACK2011-52225

DOI: https://doi.org/10.1115/IPACK2011-52225

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Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals

Proceedings Papers

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

Z. R. Lin, Z. Y. Lee, L. W. Zhang, S. F. Wang, A. A. Merrikh, G. Refai-Ahmed

Paper No: IPACK2011-52017

DOI: https://doi.org/10.1115/IPACK2011-52017

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Topics: Cooling, Graphics processing units, Heat pipes, Heat transfer

Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011

Paper No: IPACK2011-52014

DOI: https://doi.org/10.1115/IPACK2011-52014

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Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing

Proceedings Papers

Closed Loop Liquid Cooling for High Performance Computer Systems

Sukhvinder Kang, David Miller, John Cennamo

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 509-515, July 8–12, 2007

Paper No: IPACK2007-33870

DOI: https://doi.org/10.1115/IPACK2007-33870

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Topics: Computers, Cooling, Heat, Cooling systems, Copper, Fluids, Graphics processing units, Stress, Temperature, Coolants

Proceedings Papers

Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise

Colin Novak, Helen Ule, Robert Gaspar, Gamal Refai-Ahmed

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 373-378, July 17–22, 2005

Paper No: IPACK2005-73264

DOI: https://doi.org/10.1115/IPACK2005-73264

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Topics: Computers, Noise (Sound), Cooling, Graphics processing units, Sound quality, Energy dissipation, Acoustics, Fans, Heat, Heat flux

Proceedings Papers

Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics

Helen Ule, Colin Novak, Robert Gaspar, Arunima Panigrahy, Gamal Refai-Ahmed

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 239-243, July 17–22, 2005

Paper No: IPACK2005-73180

DOI: https://doi.org/10.1115/IPACK2005-73180

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Topics: Acoustics, Computers, Noise (Sound), Fans, Cooling, Flow (Dynamics), Graphics processing units, Air flow, Axial flow, Design

Proceedings Papers

Future of Thermal Management of High End Video Cards in ATX and BTX

Gamal Refai-Ahmed, Mohammed Tantoush, Colin Novak

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 287-290, July 17–22, 2005

Paper No: IPACK2005-73219

DOI: https://doi.org/10.1115/IPACK2005-73219

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Topics: Thermal management, Graphics processing units, Cooling, Power density, Roads, Thermomechanics

NARROW

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Design and Application of Innovative 3DVC in AI Server System

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

Robust Thermal Management for Embedded CPU and GPUs in Displays

Closed Loop Liquid Cooling for High Performance Computer Systems

Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise

Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics

Future of Thermal Management of High End Video Cards in ATX and BTX

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