1-20 of 229
Heat sinks
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Paper No: IPACK2022-97886
DOI: https://doi.org/10.1115/IPACK2022-97886
View Paper
PDF
Topics: Design, Heat sinks, Optimization
Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Paper No: IPACK2022-97204
DOI: https://doi.org/10.1115/IPACK2022-97204
View Paper
PDF
Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Paper No: IPACK2022-97481
DOI: https://doi.org/10.1115/IPACK2022-97481
View Paper
PDF
Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Adrian Jourdan, Alexander Sarvadi, Hector R. Siller, Huseyin Bostanci
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Paper No: IPACK2022-97476
DOI: https://doi.org/10.1115/IPACK2022-97476
View Paper
PDF
Topics: Additive manufacturing, Design, Heat sinks, Manufacturing, Testing, Topology
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper
PDF
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Callum Chhokar, G. Bamorovat Abadi, Nicholas McDaniel, Chris Botting, Majid Bahrami
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A010, October 25–27, 2022
Paper No: IPACK2022-98077
DOI: https://doi.org/10.1115/IPACK2022-98077
View Paper
PDF
Topics: Batteries, Fins, Heat sinks
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Paper No: IPACK2022-98066
DOI: https://doi.org/10.1115/IPACK2022-98066
View Paper
PDF
Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Paper No: IPACK2022-97446
DOI: https://doi.org/10.1115/IPACK2022-97446
View Paper
PDF
Topics: Additive manufacturing, Computer simulation, Cooling, Geometry, Heat, Heat sinks, Heat transfer, Manifolds, Nozzles
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Paper No: IPACK2021-74016
DOI: https://doi.org/10.1115/IPACK2021-74016
View Paper
PDF
Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells

Dinumol Varghese, Ahmed Sefelnasr, Mohsen Sherif, Fadi Alnaimat, Bobby Mathew
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
DOI: https://doi.org/10.1115/IPACK2021-74010
View Paper
PDF
Topics: Heat sinks, Microchannels, Photovoltaic cells, Thermal management, Thermal resistance
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
View Paper
PDF
Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Paper No: IPACK2021-69254
DOI: https://doi.org/10.1115/IPACK2021-69254
View Paper
PDF
Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Paper No: IPACK2021-69723
DOI: https://doi.org/10.1115/IPACK2021-69723
View Paper
PDF
Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
DOI: https://doi.org/10.1115/IPACK2020-2562
View Paper
PDF
Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
DOI: https://doi.org/10.1115/IPACK2020-2569
View Paper
PDF
Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
DOI: https://doi.org/10.1115/IPACK2020-2627
View Paper
PDF
Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
View Paper
PDF
Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Paper No: IPACK2020-2516
DOI: https://doi.org/10.1115/IPACK2020-2516
View Paper
PDF
Topics: Energy gap, Heat sinks, Optimization, Cooling, Heat, Energy conversion, Power semiconductor devices, Reliability, Semiconductor devices, Steady state
Proceedings Papers

Partitioned Heat Sinks for Improved Natural Convection

Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 27–29, 2020
Paper No: IPACK2020-2553
DOI: https://doi.org/10.1115/IPACK2020-2553
View Paper
PDF
Topics: Heat sinks, Natural convection
Proceedings Papers

Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics

Darryl Jennings, Jr., Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 27–29, 2020
Paper No: IPACK2020-2527
DOI: https://doi.org/10.1115/IPACK2020-2527
View Paper
PDF
Topics: Computational fluid dynamics, Cooling, Friction, Heat sinks, Microchannels, Nanofluids, Nanostructures