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Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
Proceedings Papers
Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69317
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
Proceedings Papers
Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6457
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48393
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73072
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 491-496, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89257
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33407
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73407
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 727-731, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73214