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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022

Paper No: IPACK2022-96635

DOI: https://doi.org/10.1115/IPACK2022-96635

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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids

Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022

Paper No: IPACK2022-97283

DOI: https://doi.org/10.1115/IPACK2022-97283

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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids

Proceedings Papers

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Tanvir Ahmed Chowdhury, Shawn A. Putnam

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 26–28, 2021

Paper No: IPACK2021-69317

DOI: https://doi.org/10.1115/IPACK2021-69317

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Topics: Cooling, Impingement cooling

Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021

Paper No: IPACK2021-74016

DOI: https://doi.org/10.1115/IPACK2021-74016

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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)

Proceedings Papers

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019

Paper No: IPACK2019-6457

DOI: https://doi.org/10.1115/IPACK2019-6457

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Topics: Convection, Impingement cooling, Machinery, Temperature, Transmission fluids

Proceedings Papers

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015

Paper No: IPACK2015-48393

DOI: https://doi.org/10.1115/IPACK2015-48393

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Topics: Computer cooling, Jets, Flow (Dynamics), Heat transfer coefficients, Reynolds number, Copper, Electronics, Heat flux, Impingement cooling, Sensors

Proceedings Papers

Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid

Caner Senkal, Shuichi Torii

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A015, July 16–18, 2013

Paper No: IPACK2013-73072

DOI: https://doi.org/10.1115/IPACK2013-73072

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Topics: Heat transfer, Nanofluids, Water, Energy dissipation, Heat, Particulate matter, Electronic components, Jets, Computer cooling, Convection

Proceedings Papers

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Yoon Jin Won, Jae ho Lee, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 491-496, July 19–23, 2009

Paper No: InterPACK2009-89257

DOI: https://doi.org/10.1115/InterPACK2009-89257

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Topics: Design, Impingement cooling, Microelectromechanical systems, Optimization, Cooling, Computer cooling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Pressure drop

Proceedings Papers

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Niru Kumari, Shankar Krishnan, Suresh V. Garimella

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007

Paper No: IPACK2007-33407

DOI: https://doi.org/10.1115/IPACK2007-33407

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Topics: Cooling, Energy dissipation, Heat, Heat sinks, Impingement cooling, Junctions, Metal foams, Microchannels, Pumps, Semiconductors (Materials)

Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005

Paper No: IPACK2005-73407

DOI: https://doi.org/10.1115/IPACK2005-73407

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Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management

Proceedings Papers

Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

W. Kinzy Jones, Surya Kappagantula, Marc Zampino

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 727-731, July 17–22, 2005

Paper No: IPACK2005-73214

DOI: https://doi.org/10.1115/IPACK2005-73214

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Topics: Ceramics, Impingement cooling, Low temperature, Microchannels

NARROW

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

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