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Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling

Tanvir Ahmed Chowdhury, Shawn A. Putnam
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69317
https://doi.org/10.1115/IPACK2021-69317
View Paper titled, Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling
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Topics: Cooling, Impingement cooling
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6457
https://doi.org/10.1115/IPACK2019-6457
View Paper titled, Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid
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Topics: Convection, Impingement cooling, Machinery, Temperature, Transmission fluids
Proceedings Papers

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48393
https://doi.org/10.1115/IPACK2015-48393
View Paper titled, Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling
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Topics: Computer cooling, Jets, Flow (Dynamics), Heat transfer coefficients, Reynolds number, Copper, Electronics, Heat flux, Impingement cooling, Sensors
Proceedings Papers

Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid

Caner Senkal, Shuichi Torii
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73072
https://doi.org/10.1115/IPACK2013-73072
View Paper titled, Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid
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Topics: Heat transfer, Nanofluids, Water, Energy dissipation, Heat, Particulate matter, Electronic components, Jets, Computer cooling, Convection
Proceedings Papers

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Yoon Jin Won, Jae ho Lee, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 491-496, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89257
https://doi.org/10.1115/InterPACK2009-89257
View Paper titled, An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device
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Topics: Design, Impingement cooling, Microelectromechanical systems, Optimization, Cooling, Computer cooling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Pressure drop
Proceedings Papers

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Niru Kumari, Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33407
https://doi.org/10.1115/IPACK2007-33407
View Paper titled, Analysis and Performance Comparison of Competing Desktop Cooling Technologies
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Topics: Cooling, Energy dissipation, Heat, Heat sinks, Impingement cooling, Junctions, Metal foams, Microchannels, Pumps, Semiconductors (Materials)
Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73407
https://doi.org/10.1115/IPACK2005-73407
View Paper titled, Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics
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Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management
Proceedings Papers

Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

W. Kinzy Jones, Surya Kappagantula, Marc Zampino
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 727-731, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73214
https://doi.org/10.1115/IPACK2005-73214
View Paper titled, Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates
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Topics: Ceramics, Impingement cooling, Low temperature, Microchannels