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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
DOI: https://doi.org/10.1115/IPACK2022-96635
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Paper No: IPACK2015-48094
DOI: https://doi.org/10.1115/IPACK2015-48094
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Topics: Heat transfer, Momentum, Nozzles, Boundary-value problems, Flow (Dynamics), Temperature, Computational fluid dynamics, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural)
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Paper No: IPACK2015-48382
DOI: https://doi.org/10.1115/IPACK2015-48382
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Paper No: IPACK2015-48393
DOI: https://doi.org/10.1115/IPACK2015-48393
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Topics: Computer cooling, Jets, Flow (Dynamics), Heat transfer coefficients, Reynolds number, Copper, Electronics, Heat flux, Impingement cooling, Sensors
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Paper No: IPACK2015-48689
DOI: https://doi.org/10.1115/IPACK2015-48689
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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Heat Transfer due to the Impingement of an Axisymmetric Synthetic Jet Emanating From a Circular Orifice: A Numerical Investigation of a Canonical Geometry

M. Ebrahim, L. Silva, A. Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A003, July 16–18, 2013
Paper No: IPACK2013-73033
DOI: https://doi.org/10.1115/IPACK2013-73033
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Topics: Geometry, Heat transfer, Flow (Dynamics), Reynolds number, Suction, Actuators, Convection, Cooling, Cycles, Diffusion (Physics)
Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A044, July 16–18, 2013
Paper No: IPACK2013-73204
DOI: https://doi.org/10.1115/IPACK2013-73204
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Topics: Boiling, Flow (Dynamics), Jets, Subcooling, Heat transfer coefficients, Heat transfer, Microchannels, Momentum, Wall temperature, Boundary layers
Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Paper No: IPACK2013-73063
DOI: https://doi.org/10.1115/IPACK2013-73063
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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer
Proceedings Papers

Experimental Study of the Convective Heat Transfer From a Geometrically Scaled Up 2D Impinging Synthetic Jet

Luis Silva, Alfonso Ortega, Isaac Rose
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A030, July 16–18, 2013
Paper No: IPACK2013-73139
DOI: https://doi.org/10.1115/IPACK2013-73139
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Topics: Acoustics, Actuators, Air flow, Computer simulation, Convection, Cooling, Cycles, Flow (Dynamics), Fluids, Geometry
Proceedings Papers

Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid

Caner Senkal, Shuichi Torii
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A015, July 16–18, 2013
Paper No: IPACK2013-73072
DOI: https://doi.org/10.1115/IPACK2013-73072
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Topics: Heat transfer, Nanofluids, Water, Energy dissipation, Heat, Particulate matter, Electronic components, Jets, Computer cooling, Convection
Proceedings Papers

Numerical Simulation of Local Heat Transfer and Scaling of a Synthetic Impinging Jet in a Canonical Geometry

Luis Silva, Alfonso Ortega
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 113-121, July 6–8, 2011
Paper No: IPACK2011-52053
DOI: https://doi.org/10.1115/IPACK2011-52053
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Topics: Computer simulation, Geometry, Heat transfer, Momentum, Vortices, Flow (Dynamics), Fluids, Jets, Outflow, Convection
Proceedings Papers

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011
Paper No: IPACK2011-52262
DOI: https://doi.org/10.1115/IPACK2011-52262
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Topics: Air jets, Cooling, Jets, Microelectronic devices
Proceedings Papers

Energy Conversion Efficiency of Synthetic Jets

Ri Li, Rajdeep Sharma, Mehmet Arik
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 115-122, July 6–8, 2011
Paper No: IPACK2011-52034
DOI: https://doi.org/10.1115/IPACK2011-52034
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Topics: Energy conversion, Jets, Electricity (Physics), Energy efficiency, Signals, Actuators, Air flow, Design, Piezoelectric actuators, Cooling
Proceedings Papers

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Yogen Utturkar, Mehmet Arik, Tunc Icoz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009
Paper No: InterPACK2009-89322
DOI: https://doi.org/10.1115/InterPACK2009-89322
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Topics: Design, Electronics, Heat sinks, Cooling, Air jets, Computer simulation, Condensation, Dynamics (Mechanics), Electronic systems, Energy dissipation
Proceedings Papers

A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 811-818, July 8–12, 2007
Paper No: IPACK2007-33708
DOI: https://doi.org/10.1115/IPACK2007-33708
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Topics: Air jets, Buckling, Cooling, Dimensions, Engineering simulation, Flow (Dynamics), Heat, Heat transfer, Jets, Microelectronic devices
Proceedings Papers

A Fundamental Approach to Modeling Transport to an Impinging Spray

Andrea C. Ashwood, Curtis Lane, Benjamin M. Regner, Timothy A. Shedd
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 267-272, July 8–12, 2007
Paper No: IPACK2007-33898
DOI: https://doi.org/10.1115/IPACK2007-33898
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Topics: Modeling, Sprays, Liquid films, Computer simulation, Fittings, Simulation, Computational fluid dynamics, Drops, Fluids, Jets
Proceedings Papers

Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows

Mehmet Arik, Yogen Utturkar, Mustafa Gursoy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 123-128, July 8–12, 2007
Paper No: IPACK2007-33188
DOI: https://doi.org/10.1115/IPACK2007-33188
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Topics: Buoyancy, Cooling, Flow (Dynamics), Gravity (Force), Heat transfer, Boundary layers, Convection, Cross-flow, Energy dissipation, Heat
Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
DOI: https://doi.org/10.1115/IPACK2005-73407
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Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management