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Proceedings Papers

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Paper No: IPACK2022-97400
DOI: https://doi.org/10.1115/IPACK2022-97400
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Topics: Boiling, Computer cooling, Cooling, Copper, Flow (Dynamics), Heat flux, Metal foams
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
DOI: https://doi.org/10.1115/IPACK2021-73015
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management

Justin Broughton, Yogendra Joshi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
DOI: https://doi.org/10.1115/IPACK2019-6519
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Topics: Additive manufacturing, Electronics, Metal foams, Modeling, Thermal management
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Paper No: IPACK2015-48535
DOI: https://doi.org/10.1115/IPACK2015-48535
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A008, July 6–9, 2015
Paper No: IPACK2015-48745
DOI: https://doi.org/10.1115/IPACK2015-48745
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Topics: Aluminum alloys, Heat sinks, Metal foams, Computer-aided design, Computerized tomography, Finite element analysis, Geometry, Computer software, Engineering systems and industry applications, Mechanical behavior
Proceedings Papers

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Niru Kumari, Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007
Paper No: IPACK2007-33407
DOI: https://doi.org/10.1115/IPACK2007-33407
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Topics: Cooling, Energy dissipation, Heat, Heat sinks, Impingement cooling, Junctions, Metal foams, Microchannels, Pumps, Semiconductors (Materials)
Proceedings Papers

Analysis of Constant-Heat-Flux Heat Transfer in Metal Foam

Nihad Dukhan, Kuan-Chin Chen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 21-28, July 8–12, 2007
Paper No: IPACK2007-33051
DOI: https://doi.org/10.1115/IPACK2007-33051
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Topics: Heat, Heat transfer, Metal foams, Fluids, Heat conduction, Heat flux, Temperature profiles, Thermal equilibrium, Aluminum, Convection
Proceedings Papers

Assessments of Single-Phase Liquid Cooling Enhancement Techniques for Microelectronic Systems

H. Y. Zhang, D. Pinjala, M. K. Iyer, R. Nagarajan, Y. K. Joshi, T. N. Wong, K. C. Toh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Paper No: IPACK2005-73040
DOI: https://doi.org/10.1115/IPACK2005-73040
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Topics: Cooling, Metal foams, Microchannels, Pressure drop, Heat sinks, Silicon, Aluminum, Brazing, Copper, Density