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Proceedings Papers

Material Impact With Package Solution for 5G RF Application

Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 27–29, 2020
Paper No: IPACK2020-2507
DOI: https://doi.org/10.1115/IPACK2020-2507
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Topics: Design, Millimeter waves, Signals, System architecture
Proceedings Papers

RFIC Transformer With 12x Size Reduction and 15x Performance Enhancement by Self-Rolled-Up Membrane Nanotechnology

Wen Huang, Moyang Li, Songbin Gong, Xiuling Li
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A002, July 6–9, 2015
Paper No: IPACK2015-48585
DOI: https://doi.org/10.1115/IPACK2015-48585
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Topics: Membranes, Nanotechnology, Size reduction (Materials), Complementary metal oxide semiconductors, Millimeter waves, Stress
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Paper No: IPACK2005-73127
DOI: https://doi.org/10.1115/IPACK2005-73127
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Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Characterization of Vertical Interconnects in 3-D System in a Package

Qinghua Kang, Altan M. Ferendeci
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 13-18, July 6–11, 2003
Paper No: IPACK2003-35247
DOI: https://doi.org/10.1115/IPACK2003-35247
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Topics: System-in-package, Circuits, Microwaves, Microelectromechanical systems, Dimensions, Junctions, Microfabrication, Millimeter waves, Transmission lines, Wavelength
Proceedings Papers

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

Liang Chai, Aziz Shaikh, Vern Stygar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 827-831, July 6–11, 2003
Paper No: IPACK2003-35134
DOI: https://doi.org/10.1115/IPACK2003-35134
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Topics: Microwaves, Millimeter waves, Strip transmission lines, Ceramics, Metals, Silver, Arches, Capacitors, Cavities, Imaging
Proceedings Papers

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Yang Ju, Hiroshi Yamamoto, Masumi Saka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Paper No: IPACK2003-35118
DOI: https://doi.org/10.1115/IPACK2003-35118
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Topics: Millimeter waves, Nondestructive evaluation, Delamination, Reflectance, Resolution (Optics), Sensors, Silicon chips, Solders