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Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Open the PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability in another window
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74115
https://doi.org/10.1115/IPACK2021-74115
View Paper titled, Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding
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Topics: Batteries, Bending (Stress), Biomedical equipment, Electronics, Flexible electronics, Industrial research, Lithium-ion batteries, Regression models, Stress
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
https://doi.org/10.1115/IPACK2020-2661
View Paper titled, Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
Open the PDF for Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates in another window
Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6570
https://doi.org/10.1115/IPACK2019-6570
View Paper titled, Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources
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Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48638
https://doi.org/10.1115/IPACK2015-48638
View Paper titled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Dinesh Arunachalam, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 537-547, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52195
https://doi.org/10.1115/IPACK2011-52195
View Paper titled, Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics
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Topics: Alloys, Architecture, Ball-Grid-Array packages, Copper, Cycles, Design, Electronics, Failure data, Lead-free solders, Model development
Proceedings Papers

PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics

Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 159-170, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89329
https://doi.org/10.1115/InterPACK2009-89329
View Paper titled, PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
Open the PDF for PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics in another window
Topics: Electronics, Fatigue, Thermomechanics, Temperature, Ball-Grid-Array packages, Cycles, Reliability, Alloys, Architecture, Copper
Proceedings Papers

DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

Ming-Che Hsieh, Wei Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 95-99, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33510
https://doi.org/10.1115/IPACK2007-33510
View Paper titled, DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses
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Topics: Geometry, Stress, Copper, Finite element analysis, Dimensions, Dielectric materials, Response surface methodology, Design, Design methodology, Experimental design